Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

Zaal, J.J.M.; Hochstenbach, H.P.; Driel, W.D. van; Zhang, G.Q.

doi:10.1016/j.microrel.2009.03.008

Cited by 13 publications

(5 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Some prior use of the FE method to analyse an interconnect pull test can be found in the literature. Zaal et al 14,15 used FE simulations to calculate the distribution of plastic strain in a solder ball during a pull test. Yeh and Lai 16 used FE calculations with a strain-rate dependent material model to investigate the switch from a ductile failure of the interconnect to a (desired) brittle interfacial failure at the substrate at increasing pull speed.…”

Section: Fe Analysis Need For Numerical Analysismentioning

confidence: 99%

Calculation of optimal jaw geometry for an electronic bond pull test

Symons

Chen

Alton

2013

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

A bond pull test is used to determine the strength of the bond of an electronic interconnect to a circuit board. A standard test consists of clamping and pulling the interconnect with a pair of microscopic jaws. In a successful test, the maximum pulling force registered by the jaws will be the failure load of the interconnect to circuit board bond. However, if the interconnect itself deforms before the bond has failed, then this would constitute an unsuccessful test. This paper reports on a theoretical analysis of the optimal geometry for gripping of a cylindrical interconnect. Upper and lower-bound plasticity models have been used to determine the jaw proportions that will maximize the load for the deformation of the interconnect and that should, therefore, be most likely to allow successful measurement of the bond strength. This theoretical analysis is compared to 2D and 3D non-linear finite element calculations. The 2D finite element models are axi-symmetric approximations of a pull test on a cylindrical interconnect. 3D finite element models take into account the actual jaw geometry and allow simulation of both clamping and pulling stages. The maximum calculated pull forces for both 2D and 3D simulations are in good agreement with the plasticity theory. Preliminary validation of the theory and finite element results has been accomplished through experimental clamping and pulling tests on cylindrical metal rods.

show abstract

Section: Fe Analysis Need For Numerical Analysismentioning

confidence: 99%

Calculation of optimal jaw geometry for an electronic bond pull test

Symons

Chen

Alton

2013

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

show abstract

“…Steel ball induced impacts also involve lift and fall process which can not reduce testing time significantly. High speed pull, thrust, and micro-impact test are also proposed to characterize the solder joints failure modes in drop impacts [6][7][8]. Because the high speed loadings like pull or thrust can produce similar strain rate as that in drop test.…”

Section: Jedec (Joint Electronic Devices Engineering Council)mentioning

confidence: 99%

Harmonic vibration test for accelerated reliability assessment of board level packaging

Liu

Sun

Zhang

et al. 2012

2012 7th International Forum on Strategic Technology (IFOST)

View full text Add to dashboard Cite

Board level package reliability under mechanical shock has always been a great concern for mobile electronic products. As a result of "short to market" demand for new electronic products, a great effort has always been made towards developing more efficient methods for reliability assessments. This paper presents a board level mechanical reliability test method based on harmonic vibration. Numerical simulation was used to determine the relationship between vibrating conditions and the sample responses. Strain gauges were used to measure the PCB deformation and verify the modeling. Failure detection system was constructed to collect the interconnects failure data of vibration tests. Results show that besides acceleration level, vibration amplitude is highly dependent on vibration frequency. Compared with very high pulse height and short pulse width of the acceleration in a drop impact, continuously vibration loading can achieve gradually increased vibration amplitudes until the balance of vibration loading and damping. A large amplitude vibration can be obtained using relatively low acceleration level at lowest resonance frequency, which produces similar strain amplitude in a drop impact test. Synchronal measurements of board strain and solder failure correlates loading condition with failure behavior. Failure data indicates the whole failure process can be divided into four stages. The loading cycle number to failure in vibration test is much more than those in drop impact tests. While vibration test takes much less testing time and performs much more effectively.

show abstract

“…Despite the CBP method alleviating the need to heat the solder, the clamping process used to gain a mechanical grip upon the exterior of the bump can cause irreversible, plastic deformation to the bump. This deformation has been shown to cause a bias towards brittle fracture and so the associated variables to the process must be optimized through a trial and error process [16]. The added issue to this is then that whenever a new solder, bump size or gripping system is used the variables that were previously optimized can once again become suspect.…”

Section: Introductionmentioning

confidence: 99%

Lead-Free Solder Pull-Off Stress Comparison of a Novel Bump Pull Method with Conventional Hot/Cold Bump Pull Methods

Turner

Meyer

2018

RDMS

View full text Add to dashboard Cite

A novel method for directly testing the adhesion strength of three lead-free solders was developed and compared with conventional methods. The Isotraction Bump Pull method utilizes a combination of favorable qualities of the Cold and Hot Bump Pull tests. Solder bumps were generated onto copper printed circuit board substrates using an in-house-fabricated solder bump-on-demand generator. The method uses polymer epoxy to encapsulate solder bumps under uniform tractions, and tested under tension for pull-off stresses. Maximum pull-off stresses for the novel method are: 18MPa (Sn-3.5Ag), 16MPa (SAC 305) and 22MPa (Sn-0.7Cu) and fall at the low end in the literature comparisons. It is suggested that since the copper substrates used in the current work were untreated, that the lower pull-off stress values resulted. Energy Dispersive X-Ray Spectrometry of the newly created faces after fracture shows that brittle fracture of the Intermetallic Compound layer was the mode of failure..

show abstract

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

Cited by 13 publications

References 11 publications

Calculation of optimal jaw geometry for an electronic bond pull test

Calculation of optimal jaw geometry for an electronic bond pull test

Harmonic vibration test for accelerated reliability assessment of board level packaging

Lead-Free Solder Pull-Off Stress Comparison of a Novel Bump Pull Method with Conventional Hot/Cold Bump Pull Methods

Contact Info

Product

Resources

About