Abstract:A bond pull test is used to determine the strength of the bond of an electronic interconnect to a circuit board. A standard test consists of clamping and pulling the interconnect with a pair of microscopic jaws. In a successful test, the maximum pulling force registered by the jaws will be the failure load of the interconnect to circuit board bond. However, if the interconnect itself deforms before the bond has failed, then this would constitute an unsuccessful test. This paper reports on a theoretical analysi… Show more
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