Abstract:A novel method for directly testing the adhesion strength of three lead-free solders was developed and compared with conventional methods. The Isotraction Bump Pull method utilizes a combination of favorable qualities of the Cold and Hot Bump Pull tests. Solder bumps were generated onto copper printed circuit board substrates using an in-house-fabricated solder bump-on-demand generator. The method uses polymer epoxy to encapsulate solder bumps under uniform tractions, and tested under tension for pull-off stre… Show more
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