2020
DOI: 10.1016/j.ceramint.2020.07.161
|View full text |Cite
|
Sign up to set email alerts
|

Single-step, large-area, variable thickness sputtered WS2 film-based field effect transistors

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
8
1

Year Published

2021
2021
2024
2024

Publication Types

Select...
7

Relationship

3
4

Authors

Journals

citations
Cited by 10 publications
(9 citation statements)
references
References 48 publications
0
8
1
Order By: Relevance
“…In order to obtain WS2 thin films in a single step, growth was performed on Si/SiO2 substrates in Argon environment using WS2 target. The growth parameters that affect the WS2 channel thickness with sputtering as shown by our previous article (Acar et al, 2020) and that may affect the ambipolarity behavior other than the thickness are given in the Table 1. It was observed from the samples obtained by sputtering that as the growth time increased, WS2 nano-walls were formed in the structure.…”
Section: Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…In order to obtain WS2 thin films in a single step, growth was performed on Si/SiO2 substrates in Argon environment using WS2 target. The growth parameters that affect the WS2 channel thickness with sputtering as shown by our previous article (Acar et al, 2020) and that may affect the ambipolarity behavior other than the thickness are given in the Table 1. It was observed from the samples obtained by sputtering that as the growth time increased, WS2 nano-walls were formed in the structure.…”
Section: Methodsmentioning
confidence: 99%
“…In order to remove the residual residues on the device and to improve the contacts, annealing was performed and the device was made ready for measurement. In this section, mask design, lithography steps, metal coating, lift-off and annealing steps are explained in detail in our previous study (Acar et al, 2020).…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…In this case, the sputtering method is easiest to produce vertical heterojunctions. A vertical MoSe 2 /WSe 2 p-n heterostructure using a sputtering-CVD method has been reported [72]. The heterostructure is formed as follows; first W film was sputtered on SiO 2 /Si substrate by using sputter, and then sputtered W film was further put in a furnace for selenization.…”
Section: Fet Applications Of Sputtered Tmdcsmentioning
confidence: 99%
“…It needs to be pointed out that the device performances are not as good as the devices produced by the CVD method or the exfoliation method. The common mobility value achieved on these sputtered TMDCs FETs varies between 10 and 20 cm 2 /Vs while I on /I of f ratio varies between 10 2 and 10 7 [39,48,49,51,[66][67][68][69][70][71][72].…”
Section: Fet Applications Of Sputtered Tmdcsmentioning
confidence: 99%