1997
DOI: 10.1109/77.621988
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Single-electron transistors based on Al/AlO/sub x//Al and Nb/AlO/sub x//Nb tunnel junctions

Abstract: As an alternative to the shadow evaporation method for the preparation of ultrasmall tunnel junctions we have established the so-called self-aligned in-line technique. It was applied to the fabrication of common Al/AlO,/Al-type and, for the first time, Nb/AIO,/Nb-based single-electron transistors. The characterization of the samples at temperatures in the range of a few hundred millikelvins reveals charging effects (Coulomb blockade and gate modulation) of the quasiparticle current.

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Cited by 11 publications
(6 citation statements)
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“…Other techniques have different drawbacks. The self-aligned in-line technique (SAIL) gives a high ∆ and low junction capacitances, but rather high junction resistances and thus low current gain [19]. A recently published modification [20] of the established three layer process using a prefabricated barrier in a sandwich structure gives a very good ∆, but it will have to be scaled down by about half an order of magnitude in linear dimensions before the charging energies reach those attainable by the Niemeyer-Dolan technique at present.…”
Section: Experimental Details 21 Sample Fabricationmentioning
confidence: 99%
“…Other techniques have different drawbacks. The self-aligned in-line technique (SAIL) gives a high ∆ and low junction capacitances, but rather high junction resistances and thus low current gain [19]. A recently published modification [20] of the established three layer process using a prefabricated barrier in a sandwich structure gives a very good ∆, but it will have to be scaled down by about half an order of magnitude in linear dimensions before the charging energies reach those attainable by the Niemeyer-Dolan technique at present.…”
Section: Experimental Details 21 Sample Fabricationmentioning
confidence: 99%
“…9 This is of great importance since previously, only native oxides of the metal electrodes (e.g., Al, Cr, Ti, and Ni) formed the tunnel barrier in metal-based SETs. [10][11][12][13][14] Moreover, the use of ALD enables formation of low-k SiO 2 dielectric on metal substrates. Figure 1 shows the schematic of the fabrication steps in MIM nanodamascene SETs.…”
Section: Introductionmentioning
confidence: 99%
“…So far a number of attempts have been made to fabricate Nb-based mesoscopic junctions (Δ Nb (bulk) ≃1.5 meV) as an alternative to Al junctions [2,3,[5][6][7][8][9][10][11][12][13]. However, since the melting point of Nb is high, it is believed that the polymer resist is easily damaged by heat during the deposition process, causing the quality of the deposited Nb film to degrade [14].…”
Section: Introductionmentioning
confidence: 99%