1981
DOI: 10.1109/tns.1981.4335684
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Simulation of Radiation Damage in Solids

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1983
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Cited by 34 publications
(21 citation statements)
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“…The increase of the introduction rates of the single vacancies, di-vacancies (also suggested by Corbett 43 ), and tri-vacancies seems to have a saturation behavior for energies higher than 15 MeV, in agreement with the results of Wood et al 44 showing that primary knock on atoms (PKA's) above 12 keV are converting into lower-energy sub-cascades and point defects.…”
Section: Defect Investigationssupporting
confidence: 87%
“…The increase of the introduction rates of the single vacancies, di-vacancies (also suggested by Corbett 43 ), and tri-vacancies seems to have a saturation behavior for energies higher than 15 MeV, in agreement with the results of Wood et al 44 showing that primary knock on atoms (PKA's) above 12 keV are converting into lower-energy sub-cascades and point defects.…”
Section: Defect Investigationssupporting
confidence: 87%
“…Wood [10] and More [11] performed displacement damage simulations and measurements that are relevant to the present modeling. Their key finding is that, for a given primary knock-on atom (PKA) of sufficient energy, the ratio of the energy deposited into the production of defects contained in subclusters to the energy deposited into the production of isolated defects is essentially constant and independent of PKA energy.…”
Section: B Clustered and Isolated Defectsmentioning
confidence: 99%
“…Even though in the end only a small fraction 3 of the total energy deposition goes into the displacement of atoms (non{ionizing energy loss, NIEL), depending on the energy of the PKA, a large numberof crystal defects may beproduced in a tree{like structure [34,35,36]. The initial displacement damage is produced on the fast collision time scale of about 10 14 s to 10 12 s [35] and is complete before any thermally activated atomic motions take place. At a slower time scale, the generated vacancies and interstitials will move around and most of them ( 95%) will recombine due to diusion processes (short term annealing).…”
Section: Displacement Damage and Non{ionizing Energy Lossmentioning
confidence: 99%