Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

Géczy, Attila; Illés, Béla; Péter, Zsolt; Illyefalvi‐Vitéz, Zsolt

doi:10.1007/s00231-014-1386-1

Cited by 17 publications

(9 citation statements)

References 14 publications

(14 reference statements)

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“…The min-max deviation is omitted from Figure 7, while the range of the min-max values resulted under 61 per cent, proving the excellent repeatability of the process. In previous studies (Géczy et al, 2015), the deviation of heating factor measurements with K-type TCs fixed with alu-tape on a squareshaped PCB was 6100 s°C, pointing to approximately 65 per cent in the given range. The current improvements also come from the fact that in the current studies, the deviation caused by corners of a square-shaped PCB can be neglected due to TC positioning and round-shaped PCB design.…”

Section: E1mentioning

confidence: 85%

“…The TC fixing was performed in the approximated centre of the round-shaped sample PCB in a 20 Â 20 mm zone. Alu-tape adhesives were used for TC fixing, which is optimal from the aspect of repeatability (Géczy et al, 2015), and thermal coupling between the condensate and the PCB, because of its good thermal conductivity. This construction is shown in Figure 2.…”

Section: Methodsmentioning

confidence: 99%

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Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

Alaya

Megyeri

Busek³

et al. 2020

SSMT

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Purpose To improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring heat-level-based vapour phase reflow soldering (VPS), where – as it was found – different thermocouple constructions can affect the set parameters of the oven and resulting soldering profiles significantly. Design/methodology/approach The study experiments showed significant alteration of the heating profiles during the process of the reflowing using different construction of k-type thermocouples. In a heat-level-based VPS oven, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA) gas and water-resistant, fibreglass, thin PFA and ultrathin PFA-covered thermocouples were tested with ±1 °C precision. The oven parameters were swept according to the heating power; the length of the introduced thermocouple cables was also taken into account. An FR4-based sample PCB was used for monitoring the temperature. Findings According to the results, due to the mass and volume of the thermocouples’ wires, different transients were observed on the resulting soldering profiles on the same sample PCB. The thermocouples with lower thermal mass result in faster profiles and significantly different heating factor values compared to the thermocouples that have larger thermal mass. Consequently, the length of the thermocouple wires put in the oven has also considerable effect on the heat transfer of the PCB inside the oven as well. Originality/value The paper shows that the thermocouple construction must be taken into account when setting up a required soldering profile, while the thermal mass of the wires might cause a significant difference in the prediction of the actual and expected soldering temperatures.

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Section: E1mentioning

confidence: 85%

Section: Methodsmentioning

confidence: 99%

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

Alaya

Megyeri

Busek³

et al. 2020

SSMT

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“…Lately, this work was extended with detailed multi-physics modelling of the film wise layer formation [28]. Also, a novel simplified approach was introduced with an explicit formula [29,30], where the modelling of the heat transfer was based on film wise condensation theory for horizontal rectangular-and disc-shaped plates. The new method enables much faster calculations with low computing requirements and precise profile prediction in saturated vapor.…”

Section: Reliability and Quality Of Electronic Assembliesmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Vajk¹,

Harsányi

Poppe

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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PrefaceThroughout László Vajta, Dean of BME VIK János Levendovszky, Deputy Dean of BME VIK Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2015, the department has organized the 21 st European Wireless (EW) Conference. The EW 2015 conference hosted more than 140 participants from 30 different countries. The 2015 edition of EW was aimed at addressing a key theme on "5G and beyond."The next sections summarize the key research results of the department in year 2015. IoT and Smart CityThe Internet of Things (IoT) is transforming the surrounding physical objects into an ecosystem of information that enriches our everyday life. The IoT represents the convergence of advances in miniaturization, wireless connectivity, and increased data storage, and is driven by various sensors. Application and service development methods and frameworks are required to support the realization of solutions covering data collection, transmission, data processing, analysis, reporting, and advanced querying. Our SensorHUB framework URBMOBI is a mobile environmental sensor that (i) provides temporally and spatially distributed environmental data, (ii) fulfills the need for monitoring at various places without the costs for a large number of fixed measurement stations, (iii) integrates small and precise sensors in a system that can be operated on buses, trams, or other vehicles, (iv) concentrates on urban heat and thermal comfort, and (v) aims at providing climate services and integration with real-time climate models.utilizes the state-of-the-art open source technologies and provides a unified tool chain for IoT related application and ser-URBMOBI project has been worked out between 2013 and 2015 by the following consortium: RWTH Aachen University (Germany), Netherlands Organization for Applied Scientific Research TNO (Netherlands), ARIA Technologies (France), Budapest University of Technology and Economics (Hungary), and Meteorological and Environmental Earth Observation (Italy).The SOLSUN (Sustainable Outdoor Lighting & Sensory Urban Networks) project is about to demonstrate how intelligent city infrastructure can be created in a cost-effective and sustainable way by reusing existing street lighting as the communications backbone. We apply different technologies and methods to reduce energy consumption at the same time as turning streetlights into nodes on a scalable network that is al...

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“…VPS, also well-known as condensation soldering, was used at the beginning of the early 1980s as one choice in which inert liquids based on fluorinated hydrocarbons or perfluoropolyethers are heated to a precisely defined boiling temperature. The temperature of the saturated vapour zone is the same as the boiling point of the vapour phase liquid (Géczy et al, 2016;Bo et al, 2009;Géczy et al, 2014). Standard VPS uses the latent heat of liquid vaporization to provide heat for soldering and hence to obtain reliable metal joints.…”

Section: Introductionmentioning

confidence: 99%

Real-time profiling of reflow process in VPS chamber

Livovský

Pietriková

2017

SSMT

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Purpose This paper aims to present a new method of real-time monitoring of thermal profiles applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a significant variable that affects the quality of joints. The method allows rapid achievement of a required thermal profile based on software control that brings new efficiency to the reflow process and enhanced joint quality, especially for power electronics. Design/methodology/approach A real-time monitoring system based on computerized heat control was realized in a newly developed laboratory VPS chamber using a proportional integral derivation controller within the soldering process. The principle lies in the strictly accurate monitoring of the real defined reflow profile as a reference. Findings Very accurate maintenance of the required reflow profile temperature was achieved with high accuracy (± 2°C). The new method of monitoring and control of the reflow real-time profiling was verified at various maximal reflow temperatures (230°C, 240°C and 260°C). The method is feasible for reflowing three-dimensional (3D) power modules that use various types of solders. The real-time monitoring system based on computerised heat control helped to achieve various heights of vapour zone. Originality/value The paper describes construction of a newly developed laboratory-scale VPS chamber, including novel real-time profiling of the reflow process based on intelligent continuously measured temperatures at various horizontal positions. Real-time profiling in the laboratory VPS chamber allowed reflow soldering on 3D power modules (of greater dimensions) by applying various flux-less solder materials.

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Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

Cited by 17 publications

References 14 publications

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Real-time profiling of reflow process in VPS chamber

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