Silver metallization for advanced interconnects

Manepalli, Rahul; Stepniak, F.; Bidstrup-Allen, S.A.; Kohl, Paul A.

doi:10.1109/6040.746536

Cited by 117 publications

(62 citation statements)

References 3 publications

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“…[1][2][3] In addition to the widely used copper, silver is an excellent choice in terms of electrical conductivity and residual stress. [3] The growth of silver thin films was investigated using several processes such as sputtering, [4] electron-beam evaporation, [5] molecular-beam epitaxy (MBE), [6] and metal-organic (MO)…”

Section: Introductionmentioning

confidence: 99%

CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

Haase¹,

Kohse‐Höinghaus²,

Bahlawane³

et al. 2005

Chemical Vapor Deposition

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Tri-n butylphosphine silver(I) complexes were synthesized and characterized with respect to their suitability for the CVD of silver thin films. The volatility and thermal stability of these complexes were investigated using temperature-programmed and in-situ mass spectrometry (MS). Complexes with smaller carboxylate ligands showed superior long-term stability and had the advantage of evaporation without decomposition. Careful examination of the fragments detected during evaporation and in a CVD reactor allowed us to propose the gas-phase decomposition mechanisms of some potentially suitable silver precursors. Deposition experiments in a cold-wall CVD reactor using selected precursors resulted in smooth and conductive silver coatings.

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Section: Introductionmentioning

confidence: 99%

CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

Haase¹,

Kohse‐Höinghaus²,

Bahlawane³

et al. 2005

Chemical Vapor Deposition

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“…[4] Silver has the highest electrical conductivity at room temperature, however its use in microelectronics is often limited by its diffusion into semiconducting substrates. [5] Thin films of silver have been deposited by many non-vacuum techniques including electrodeposition, [6] photochemical deposition, [7] electroless deposition, [8] and sol-gel. [9] Physical vapor deposition techniques include vacuum evaporation, [10] sputtering, [5,11,12] pulsed laser deposition, [13] electron beam evaporation, [14] and molecular beam epitaxy.…”

Section: Introductionmentioning

confidence: 99%

“…[5] Thin films of silver have been deposited by many non-vacuum techniques including electrodeposition, [6] photochemical deposition, [7] electroless deposition, [8] and sol-gel. [9] Physical vapor deposition techniques include vacuum evaporation, [10] sputtering, [5,11,12] pulsed laser deposition, [13] electron beam evaporation, [14] and molecular beam epitaxy. [15] Among these various techniques, CVD has the advantage of potentially superior step-coverage, and is a single-step process which can easily be scaled up to deposit high purity films over large areas.…”

Section: Introductionmentioning

confidence: 99%

The Aerosol‐Assisted CVD of Silver Films from Single‐Source Precursors

Panneerselvam

Malik

O’Brien

et al. 2009

Chemical Vapor Deposition

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Thin films of silver are deposited from tetraphenyldioxoimidodiphosphinato silver(I) [Ag{(OPPh 2 ) 2 N}] 4 Á 2H 2 O (1) and silver(I) triflouoroacetate CF 3 COOAg (2) single-source precursors (SSPs) by the aerosol-assisted (AA)CVD method. The complex (1) is a tetramer with linear and distorted tetrahedral coordination modes at silver. Two types of films, silvery and brownish, are observed from both SSPs due to the temperature gradient in the AACVD reactor. The as-deposited films are characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, and ultraviolet/visible (UV-vis) spectroscopy methods.

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“…While Cu has been introduced successfully in microprocessors by damascene electroplating, Ag has a high potential for a nextgeneration interconnect material in ultralarge-scale interconnects ͑ULSI͒ because it has the lowest resistivity 1 and superior resistance in electromigration. [2][3][4][5][6][7] Defect-free superfilling is essential for reliable metal interconnects in damascene electroplating and it is attained by the addition of a catalytic accelerator in the electrolyte.…”

mentioning

confidence: 99%

Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects

Cho

Lee

Kim

et al. 2007

Electrochem. Solid-State Lett.

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The addition of CuCN accelerated the deposition rate in cyanide-based Ag electroplating. The catalytic effect came from the high-order complexation of Cu with the free CN − ions in electrolyte. It changed the equilibrium state of the electrolyte, presented as an increase in the amount of Ag͑CN͒ 2 − compared to Ag͑CN͒ 3 2− . Because Ag͑CN͒ 2 − could be reduced more easily, Ag electroplating was accelerated. Fourier transform infrared analysis showed the equilibrium change with the increase in Ag͑CN͒ 2 − peak according to the CuCN addition. For superfilling, it is necessary to localize the complexation on the Cu surface.

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Silver metallization for advanced interconnects

Cited by 117 publications

References 3 publications

CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

The Aerosol‐Assisted CVD of Silver Films from Single‐Source Precursors

Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects

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Silver metallization for advanced interconnects

Cited by 117 publications

References 3 publications

CVD with Tri‐nbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

CVD with Tri‐nbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

The Aerosol‐Assisted CVD of Silver Films from Single‐Source Precursors

Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects

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CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions

CVD with Tri‐ⁿbutylphosphine Silver(I) Complexes: Mass Spectrometric Investigations and Depositions