The
III-nitride semiconductors have many attractive properties
for field-emission vacuum electronics, including high thermal and
chemical stability, low electron affinity, and high breakdown fields.
Here, we report top-down fabricated gallium nitride (GaN)-based nanoscale
vacuum electron diodes operable in air, with record ultralow turn-on
voltages down to ∼0.24 V and stable high field-emission currents,
tested up to several microamps for single-emitter devices. We leverage
a scalable, top-down GaN nanofabrication method leading to damage-free
and smooth surfaces. Gap-dependent and pressure-dependent studies
provide new insights into the design of future, integrated nanogap
vacuum electron devices. The results show promise for a new class
of high-performance and robust, on-chip, III-nitride-based vacuum
nanoelectronics operable in air or reduced vacuum.