Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Andrae, Anders; Andersson, Dag; Liu, Johan

doi:10.1016/j.jclepro.2005.05.013

Cited by 24 publications

(14 citation statements)

References 13 publications

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“…emissions-and saving opportunities-are located in a longer chain of unit processes in the life cycle of individual products than is represented by the three suppliers of PCBs, PSUs and MEs. Andrae et al argued that the intermediate unit processes are non-negligible for upstream LCAs of electronic devices [23]. This research will be able to shed more light of the importance of these processes as the present data collection approach likely can be applied widely in the supply chain.…”

Section: Next Stepsmentioning

confidence: 76%

Delivering Tangible Carbon Emission and Cost Reduction through the ICT Supply Chain

Andrae¹,

Ab²

2018

Int. J. Green Technol.

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Abstract:Actual commitments by suppliers-in the Information and Communication Technology (ICT) supply chain-to reduce their energy use are rare. The upstream supply chain is also very complex for electronic/ICT products and therefore challenging to control and measure for use by Life Cycle Assessments (LCAs) of products and upstream Scope 3 footprints of companies. In LCAs primary measured data over time are rarely used. The purpose of this research is to propose a method for identification, measurement and analysis of specific energy (electric power) and CO2-eq. savings in the supply chain of an ICT Original Equipment Manufacturer (OEM). The aim is also to find the share of the supply chain savings-of energy use and CO2-eq. emissions-compared with a telecom carriers' total supply chain spend for an identified contract. It is described how three suppliers of a large ICT OEM are engaged-via a contractual requirement-to identify and commit to substantial energy, cost and CO2-eq. savings. First streamlined LCAs are performed-of four specific products-identifying the most impacting parts from a CO2-eq. perspective. Second specific suppliers and factories are identified. Third visits are done in which energy assessments are made, savings identified, implementation costs quantified, and net cost saving opportunities are calculated. The suppliers are also trained in the International Performance Measurement and Verification Protocol (IPMVP). The last steps include quantifications and analyses of Energy and Conservation Measures (ECMs), final agreement of net CO2-eq. and cost savings followed by actual implementation and monitoring with IPMVP. All in all these efforts are estimated to help save around 27,000 MWh energy and around 25,700 tonnes CO2-eq. annually. For a five-year rollout contract around 1.5 times more CO2-eq. can be saved than emitted. More than 1% of the telecom carrier's annual energy consumption and Scope 3 'Purchased goods and services' emissions can be saved. This shows a clear indication of the possibilities of the proposed approach. Broadly speaking, the methodology presented is a potentially replicable model that can be used by ICT OEMs to make significant cuts within their supply chain, while lowering their suppliers' operational cost base. By using the proposed methodology it is possible to address specific suppliers and engage them via a contractual requirement to identify and commit to specific savings to the benefit of ICT OEMs and telecom carriers both. In order to improve the current practice, the next step is to integrate the savings framework into an end-to-end dynamic framework based on LCA.

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Section: Next Stepsmentioning

confidence: 76%

Delivering Tangible Carbon Emission and Cost Reduction through the ICT Supply Chain

Andrae¹,

Ab²

2018

Int. J. Green Technol.

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“…0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 BCl 3 0.00E+00 0.00E+00 0.00E+00 Pb 1.22E-05 6.76E-06 2.70E-05 WF 6 4.32E-03 1.64E-02 6.54E-02 HBr 0.00E+00 3.99E-03 1.59E-02 Br 2 0.00E+00 0.00E+00 0.00E+00 HMDS 0.00E+00 1.02E-01 4.07E-01 OMCTS 0.00E+00 0.00E+00 0.00E+00 CRITERIA CO 4.22E-03 0.00E+00 0.00E+00 NO 2.21E-03 0.00E+00 0.00E+00 NO 2 2.88E-04 0.00E+00 0.00E+00…”

Section: Further Study Of the "Rebound Effect" Of Computational Powermentioning

confidence: 99%

“…0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 0.00E+00 PH 3 0.00E+00 0.00E+00 0.00E+00 BTBAS 4.78E-06 2.39E-06 9.57E-06 AsH 3 0.00E+00 0.00E+00 0.00E+00 BCl 3 0.00E+00 0.00E+00 0.00E+00 Pb 0.00E+00 0.00E+00 0.00E+00 WF 6 2.04E-03 1.02E-03 4.08E-03 HBr 0.00E+00 0.00E+00 0.00E+00 Br 2 0.00E+00 0.00E+00 0.00E+00 HMDS 0.00E+00 0.00E+00 0.00E+00 OMCTS 0.00E+00 0.00E+00 0.00E+00 CRITERIA CO 6.00E-01 3.00E-01 1.20E+00 NO 6.78E-03 3.39E-03 1.36E-02 NO 2 6.46E-03 3.23E-03 1.29E-02…”

Section: Further Study Of the "Rebound Effect" Of Computational Powermentioning

confidence: 99%

“…Emissions to Air kg/wafer expected value low high GWG CF 4 2.28E-04 1.03E-03 4.13E-03 CHF 3 3.43E-06 5.13E-04 2.05E-03 C 2 F 6 4.82E-07 0.00E+00 0.00E+00 CH 4 2.53E-04 1.29E-01 5.18E-01 CO 2 7.12E-01 0.00E+00 0.00E+00 NF 3 4.97E-04 1.15E-01 4.61E-01 C 4 F 6 5.66E-06 3.61E-05 1.45E-04 N 2 O 0.00E+00 0.00E+00 0.00E+00 HAZARDOUS F 2 3.69E-03 0.00E+00 0.00E+00 HF (gas)…”

Section: Appendix Cmentioning

confidence: 99%

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Life-Cycle Assessment of Semiconductors

Boyd¹

2012

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This thesis is the first complete and transparent study of the life-cycle environmental impacts of semiconductor chips using process-level data, as well as the first analysis of the changes in these impacts over time. LCA of complementary metal oxide semiconductor (CMOS) logic, flash memory and dynamic random access memory (DRAM) are presented. CMOS logic is the most common form of digital logic used today. This thesis provides a life cycle assessment for CMOS chips over 7 technology generations with the purpose of comparing impacts by life cycle stage, examining their trends over time and evaluating their sensitivity to data uncertainty and changes in production metrics such as yield. A hybrid life cycle assessment (LCA) model is used; Wafer production, electricity generation, water supply and certain materials are represented by process LCA data, while the remaining materials are described using economic input-output (EIO) LCA methods. It is determined that, in the case of CMOS logic, life-cycle impacts in all but one category are dominated by the use phase, and impacts are most sensitive to those variables which define use phase energy demand (chip power demand, usage patterns, power supply efficiency and chip lifetime). Using the same methodology, LCA of flash memory over 5 technology generations is presented. The most recent generation of flash memory is compared with magnetic storage, using a laptop hard-drive as a functional unit, and it is determined that in most impact categories, a flash-based drive will result in fewer impacts. Life-cycle impacts of DRAM, over 6 technology generations, are presented using as the functional unit, the memory requirements a popular operating system in each year of production. The influence of the choice of functional unit on results in semiconductor LCA is examined, and it is argued that functional unit is best defined as a computational power or memory capacity required for a given function, within a set time period. The LCA impact and inventory results for these three types of semiconductor products allow more accurate assessment of the environmental ben-1 efit or costs of information technology relative to traditional products and services.

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“…TVs, notably some efforts in which the occurrence of fires is incorporated into the environmental impact calculations (Andersson et al 2003(Andersson et al , 2004De Poortere et al 2000;Hamzia et al 2008;Simonson et al 2002). Some additional studies have been found on aspects of the life cycle of printed wiring boards (PWBs), which are an important application of flame retardants (Alaee et al 2003;Andrae et al 2005;Iji and Yokoyama 1997;Scharnhorst et al 2005). …”

Section: Introductionmentioning

confidence: 99%