Si-based system-in-package design with broadband interconnection for E-band applications

Abstract

This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radiofrequency (RF) interconnection from carrier board to the die is carefully designed based on the impedance transformation characteristic of the transmission line (TL). In addition, the simulation results show that the designed interconnection is robust to moderate process deviations. To verify the electrical performance of the designed interconnection, a dummy testing structure is designed, fabricated and measured. The measurement results show that the return loss is less than −10.6 dB in the commercial communication frequency range of 71-86 GHz for E-band applications.

A Wire-Bonded Patch Antenna for Millimeter Wave Applications

“…A popular method of improving the performance of wire bond connections is based on placing multiple parallel wires or a ribbon [9][10][11]; however, it is often insufficient at frequencies approaching 100 GHz. Another way of the efficient application of wire bonds in mm-wave devices is to arrange them in the inductance-capacitance-inductance (LCL) tee section or differential configuration with microstrip stubs [5,[12][13][14], which forms an impedance matching circuit. Impedance mismatch can also be reduced by means of an external matching network [15,16].…”

A failure location technology for SiP devices based on TDR nondestructive testing method

“…At present, the research on SiP devices mainly focuses on the design, processing and reliability evaluation, whereas less attention is paid to the new failure location technology (Dai et al , 2021; Chu et al , 2021). The existing nondestructive failure location analysis methods of SiP devices mainly include 2D/3D X-ray, scanning acoustic microscopy, magnetic microscopy defect location techniques, microscopic infrared thermography detection technique and optical emission techniques (Kong et al , 2020; Zaki et al , 2015; Wang et al , 2020).…”