A Wire-Bonded Patch Antenna for Millimeter Wave Applications

Bogdan, Grzegorz; Sobolewski, Jakub; Bajurko, Paweł; Yashchyshyn, Yevhen; Oklej, Jan; Ostaszewski, D.

doi:10.3390/electronics12030632

Cited by 4 publications

(3 citation statements)

References 41 publications

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“…In the semiconductor industry, wire bonding has been a dominant interconnection technology in electronic packages. Continuous studies; up to very recent, are still being carried out to elevate the effectiveness of the technology and its outcome in terms of wire bond quality [1][2][3]. Interconnection of micron wires to metal pads is an essential process for the fabrication of these components for signal and power transfer [4].…”

Section: Introductionmentioning

confidence: 99%

Thermal Misfit and Diffusion Induced Stresses of Cu-Al Intermetallics in Microelectronics Wire Bonding

Shariza,

Anand

2024

DDF

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The thermosonic bonding technique is a widely used method for Cu wire interconnections. However, issues arise due to volumetric changes in intermetallic compounds (IMCs) formed at the Cu-Al bonding interface, leading to voids in the Cu-Al IMC layer. This problem is exacerbated after annealing, such as in high-temperature Storage (HTS). In this study, a statistical modelling approach was employed to quantitatively analyse stress, studying the evolution and characteristics of the interfacial microstructure in the thermosonic Cu wire-Al bond pad system. Microstructural analysis focused on Cu-Al IMC crystallography and compositional classification. A stress model was proposed, considering both thermal misfit and diffusion-induced stresses. Results showed that interfacial stress generally increased with higher bonding temperatures. The influence of forming gas supply was relatively minor, with oxide layers minimally impeding Cu-Al interdiffusion during Cu-Al IMC formation. This stress modelling technique hold potential as a valuable failure analysis tool for implementing Cu wire in various industries.

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Section: Introductionmentioning

confidence: 99%

Thermal Misfit and Diffusion Induced Stresses of Cu-Al Intermetallics in Microelectronics Wire Bonding

Shariza,

Anand

2024

DDF

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“…The use of full-wave electromagnetic (EM) simulation software is a standard practice in microwave design today. EM analysis is being used throughout the entire design cycle of microwave devices and systems, starting from topology development [1][2][3][4] through parametric studies [5], to the final refinement of circuit dimensions [6][7][8][9][10][11]. This is primarily because EM analysis is able to accurately account for various phenomena exerting significant effects on circuit responses, such as EM cross-coupling [12][13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Cost-Efficient Two-Level Modeling of Microwave Passives Using Feature-Based Surrogates and Domain Confinement

Pietrenko-Dabrowska,

Koziel,

Zhang

2023

Electronics

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A variety of surrogate modeling techniques has been utilized in high-frequency design over the last two decades. Yet, the curse of dimensionality still poses a serious challenge in setting up reliable design-ready surrogates of modern microwave components. The difficulty of the modeling task is only aggravated by nonlinearity of circuit responses. Consequently, constructing a practically usable surrogate model, valid across extended ranges of material, geometry, and operational parameters, is far from easy. As a matter of fact, conventional modeling techniques are merely capable of building models for microwave structures featuring a relatively small number of designable parameters within reduced ranges thereof. One possible way of mitigating these obstacles may be the employment of the recently proposed two-stage performance-driven modeling approach. Therein, the surrogate model domain is narrowed down to the section of the space where the vectors of adequate quality are located, thereby permitting significantly reducing the cost of acquiring the training data. Seeking even further cost reduction, this work introduces a novel modeling framework, which exploits problem-specific knowledge extracted from the circuit responses to achieve substantial cost-savings of training data acquisition. In our methodology, the modeling procedure targets response features instead of the complete responses. The response features are the characteristic locations of the circuit response, such as relevant minima or maxima over selected frequency bands. The dependency of the coordinates of the said features on circuit dimensions is considerably less nonlinear than is observed for the complete characteristics, which enables sizable reduction of the data acquisition cost. Numerical validation of our procedure involving three microwave structures corroborates its remarkable efficiency, which allows for setting design-ready surrogates using only a handful of samples.

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“…Firstly, it does not require any external matching network; hence, it can be directly connected to a contact pad of an MMIC die. Secondly, the wire bond radiation effect is utilized to enhance the patch antenna gain at the broadside direction [6].…”

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confidence: 99%