Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Abstract

This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

“…The melting point decreases with terbium content up to 266.24°C (which decreased by 2.78°C than the melting point of Ag 99.5 Bi 0.5 alloy) at 0.5 Wt.% Tb. This reduction may be due to the decrease of the particle size of IMC and Bi phase, as observed in the other works (Rajendran et al , 2020; Kamal and Gouda, 2006; Peters et al , 1997; Steeb, 2012). The pasty range is increased slightly after additions of Tb but are desirable compared with Pb–Sn solder alloys.…”

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

“…Sn3.0Ag displayed void-free Cu 6 Sn 5 IMC with excellent reliability. The addition of nanoparticles in the solder effectively reduces the growth of Cu 6 Sn 5 IMC at the interface [100]. Nanoparticles have a high surface-to-volume ratio and hence get adsorbed on the Cu 6 Sn 5 IMC during reflow.…”

“…Nanoparticles have a high surface-to-volume ratio and hence get adsorbed on the Cu 6 Sn 5 IMC during reflow. After the adsorption, the nanoparticles reduce the surface energy of growing plane k by decreasing the growth rate of crystal plane k as given from the Equation (15) [100]:…”

“…The addition of nanoparticles in solder paste is widely used in research. Nanoparticles such as ZrO 2 [100], Al 2 O 3 [102], ZnO [103], and CNT [104] have been successfully added to the Sn-Ag-Cu and Sn-Bi solders to reduce the Cu 6 Sn 5 IMC at the interface and enhance the mechanical properties. Additionally, optimum nanoparticle addition is found to improve the spreading and wetting characteristics as well.…”

Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

“…The second article by Rajendran et al [2] demonstrates the spontaneous modification of intermetallic compound (IMC) growth across a Sn-3.0Ag-0.5Cu/Cu solder joint, after adding ZrO 2 nanoparticles into the Sn-3.0Ag-0.5Cu solder matrix by mechanical mixing and melting methods. The authors conducted a comparative study on the effect of bimodal particle size distributions (5-15 nm and 70-90 nm) of ZrO 2 nanoparticles in the matrix on IMC growth and shear strength at 175 • C for 256 h. Their results indicated a decrease in the joint strength corresponding to the aging time, when thicker ZrO 2 particles (70-90 nm) was used.…”