Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

Ahn, Byungmin

doi:10.3390/met11121941

Cited by 6 publications

(4 citation statements)

References 5 publications

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“…Wire bonding occupies a dominant position in the field of chip packaging because of its mature technology and low cost [1][2][3][4]. Wire bonding can connect the metal cloth welding area or microelectronic packaging I/O lead to the semiconductor chip welding area, which is an important process link in the semiconductor packaging process.…”

Section: Introductionmentioning

confidence: 99%

Processing and Properties of Single-Crystal Copper Wire

Cao,

Wu,

et al. 2023

Micromachines

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The effects of drawing parameters and annealing process on the properties and microstructure of single crystal copper wire are studied using a wire-drawing machine, heat-treatment equipment, microcomputer-controlled electronic universal tester, resistance tester, and scanning electron microscope. The results show that, after drawing the single-crystal copper wire with a single-pass deformation of 14%, the grains elongate along the tensile direction, tensile strength increases from 500.83 MPa to 615.5 Mpa, and resistivity changes from 1.745 × 10−8 Ω·m to 1.732 × 10−8 Ω·m. After drawing at a drawing rate of 500 m/min, the degree of grain refinement increases and tensile strength increases from 615.5 Mpa to 660.26 Mpa. When a copper wire of Φ0.08 mm is annealed, its tensile strength decreases from 660.26 Mpa to 224.7 Mpa, and elongation increases from 1.494% to 19.87% when the annealing temperature increases to 400 °C. When the annealing temperature increases to 550 °C, the tensile strength and elongation decrease to 214.4 MPa and 12.18%, respectively.

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Section: Introductionmentioning

confidence: 99%

Processing and Properties of Single-Crystal Copper Wire

Cao,

Wu,

et al. 2023

Micromachines

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“…Previous studies have contributed significantly by proposing new Sn-based alloys as potential alternatives to Sn-Pb alloys [10][11][12][13]. Particularly, the Sn-Ag, Sn-Ag-Cu, and Sn-Cu [wt.%] alloys seem to be the most promising choices for mechanical strength and electrical properties [14][15][16].…”

Section: Introductionmentioning

confidence: 99%

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

Cruz,

Soares,

Barros

et al. 2023

Metals

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Sn-Mg alloys are potential Pb-free solder options. However, their mechanical strength and interfacial characteristics with electronic substrates remain barely understood. This study focuses on the interfacial heat transfer aspects, microstructure, and tensile strength of a Sn-2.1wt.%Mg alloy. Samples with various thermal histories were produced using a directional solidification apparatus. In these experiments, a Sn-2.1wt.%Mg alloy was solidified on Cu and Ni substrates, which are of interest in the electronics industry. Mathematical modeling was then employed, allowing for the determination of the overall and interfacial heat transfer coefficients (hov, and hi, respectively). The results show that the Ni substrate exhibits higher interfacial thermal conductance with the Sn-2.1wt.%Mg alloy compared to the Cu substrate, as indicated by the higher hi profiles. This fact occurs mainly due to their metallurgical interaction, resulting in a stronger bond with the presence of Sn-Ni-rich intermetallics at the interface. Finally, experimental equations based on the Hall–Petch relationship are proposed to describe how the refinement of the fibrous spacing of the Mg2Sn interphase (λG) and an increase in hi enhance both yield and ultimate tensile strengths.

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“…With the rapid miniaturization of electronic circuits, thermal, electrical, and mechanical loads on three-dimensional integrated circuits (3DIC) that provide the electrical connection between the substrate and the chip have increased [1][2][3][4]. During the soldering process, a layer of IMC is formed at the solder-substrate interface.…”

Section: Introductionmentioning

confidence: 99%

A Review on Phase Field Modeling for Formation of η-Cu6Sn5 Intermetallic

Sun

Zhao

Liang

et al. 2022

Metals

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Formation of intermetallic compounds (IMCs) exhibits remarkable microstructural features and provides opportunities for microstructure control of microelectronic interconnects. Excessive formation of brittle IMCs at the Cu/Sn interface such as η-Cu6Sn5 can deteriorate the reliability and in turn lead to solder joint failure in the Pb-free Sn-based solder joints. Phase field method is a versatile tool for prediction of the mesoscopic structure evolution in solders, which does not require tracking interfaces. The relationships between the microstructures, reliability and wettability were widely investigated, and several formation and growth mechanisms were also proposed for η-Cu6Sn5. In this paper, the current research works are reviewed and the prospective of the application of phase field method in the formation of η-Cu6Sn5 are discussed. Combined phase field simulations hold great promise in modeling the formation kinetics of IMCs with complex microstructural and chemical interactions.

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Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

Abstract: In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...]

Cited by 6 publications

References 5 publications

Processing and Properties of Single-Crystal Copper Wire

Processing and Properties of Single-Crystal Copper Wire

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

A Review on Phase Field Modeling for Formation of η-Cu6Sn5 Intermetallic

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