Shallow Trench Isolation Chemical Mechanical Planarization

Stefanov, Yordan; Schwalke, Udo

doi:10.1002/9780470180907.ch12

Cited by 3 publications

(1 citation statement)

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“…[5] The microstructure, particle size, mechanical properties, chemical reactivity, and crystal structure of CeO 2 abrasives are known to directly influence both the material removal rate and surface quality. [6][7][8] Therefore, research experts have conducted numerous studies on the synthesis and DOI: 10.1002/crat.202300308 surface modification of CeO 2 abrasives to improve their polishing performance.…”

Section: Introductionmentioning

confidence: 99%

Influence of Cerium Oxide Abrasive Particle Morphologies on Polishing Performance

Ni,

Fan,

Chen

et al. 2024

Cryst. Res. Technol.

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In this study, two morphologies of cerium oxide (CeO2) abrasive particles, octahedral and spheroidal, are synthesized by solvothermal method using cerium nitrate hexahydrate (Ce(NO3)3‐6H2O) as raw material. Fourier infrared spectroscopy, X‐ray diffractometer (XRD) and scanning electron microscopy (SEM) are used to characterize the composition and morphology of CeO2 abrasive particles. The synthesized CeO2 is used for chemical mechanical polishing (CMP) of the Si surface of 6H‐SiC wafers, and the surface morphology of the polished wafers are observed using atomic force microscopy (AFM). After polishing with octahedral and spheroidal abrasive particles, the surface roughness of the wafers are 0.327 and 0.287 nm, and the material removal rates (MRR) are 870 and 742 nm h−1, respectively. Calculations comparing the ultraviolet absorption spectra and bandgap energies of the two types of abrasive particles as well as molecular dynamics (MD) simulations reveal that the synthesized octahedral CeO2 particles possessed stronger surface chemical activity and material removal performance.

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