“…2͑a͒. The results show that the S V g of 640 Hz overlaps to the S V g of 40 Hz for all V g , confirming that the PSD is 1 / f noise in the absence of visible single defect centers ͑RTS͒ 1 or shallow recombination defect centers 8 for the gate region we are interested in. The inputreferred noise in the CNT-FET is orders of magnitude larger than that in a standard metal oxide semiconductor field effect transistor ͑MOSFET͒ with the same device size.…”
Low frequency noise power spectrum density of carbon nanotubes is presented. It is shown that the input-referred noise of carbon nanotubes increases quadratically as gate voltage is overdriven, suggesting that mobility fluctuation is the dominant mechanism contributing to the noise in carbon nanotube field effect transistors. The comparison of source-drain current noise power spectrum densities of carbon nanotubes in air and in vacuum indicates that a part of device noise is due to charge fluctuations from attached air molecules.
“…2͑a͒. The results show that the S V g of 640 Hz overlaps to the S V g of 40 Hz for all V g , confirming that the PSD is 1 / f noise in the absence of visible single defect centers ͑RTS͒ 1 or shallow recombination defect centers 8 for the gate region we are interested in. The inputreferred noise in the CNT-FET is orders of magnitude larger than that in a standard metal oxide semiconductor field effect transistor ͑MOSFET͒ with the same device size.…”
Low frequency noise power spectrum density of carbon nanotubes is presented. It is shown that the input-referred noise of carbon nanotubes increases quadratically as gate voltage is overdriven, suggesting that mobility fluctuation is the dominant mechanism contributing to the noise in carbon nanotube field effect transistors. The comparison of source-drain current noise power spectrum densities of carbon nanotubes in air and in vacuum indicates that a part of device noise is due to charge fluctuations from attached air molecules.
“…Since the energy level of the trap is discrete and unique, the Fermi level scans the same traps (but for increasing depth in the depletion zone). The characteristic time constant of the Lorentzian associated with this trap does not change with gate bias variation [6]. Similar trends were observed for all the investigated devices: the RTS contributions and the G-R noise which can be related with traps located at the gate dielectric/Si interface appear in particular in strong inversion.…”
Section: Experimental Methodologysupporting
confidence: 70%
“…Thereafter, we briefly present the noise model of G-R due to traps located in the depletion region of the transistor, which, according to the theory developed in [6] leads to Lorentzians for which the characteristic frequency does not change with the applied gate voltage. In this case, the total spectral density of the carrier number fluctuations is obtained by integration of Eq.…”
Section: Theorymentioning
confidence: 99%
“…The low frequency noise (LFN) analysis has been proposed as a non-destructive diagnostic tool in order to evaluate the quality of the gate oxide interface and of the depleted silicon film [5][6][7][8][9]. The evolution of the low frequency noise with the applied gate voltage at different temperatures was already studied for pchannel standard and strained SOI FinFETs with the aim to investigate the quality of the gate oxide interface through the 1/f noise analysis [10].…”
, et al.. Identification of Si film traps in p-channel SOI FinFETs using low temperature noise spectroscopy. Solid-State Electronics, Elsevier, 2015, 112, pp
“…4b, one can derive that the Lorentzian plateau and corner frequency of the Lorentzian occurring at the lowest frequencies (~25 Hz) is not markedly dependent on the gate voltage. This strongly suggests that the underlying defects are present in the silicon depletion region [23][24][25][26][27]. This opens the door for GR noise spectroscopy as a function of temperature.…”
The variability of the low-frequency (LF) noise in n-channel MOSFETs fabricated on an Ultra Thin Buried Oxide (UTBOX) Silicon-on-Insulator (SOI) substrate has been studied and compared with the variability in the threshold voltage and low-field mobility of the same devices. No correlation has been found between the noise magnitude and the DC parameters, suggesting that the traps responsible for the current fluctuations do not affect the latter. A possible explanation is that the LF noise is dominated by Generation-Recombination (GR) centers in the silicon film, which have less impact on the drain current.
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