Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

Liu, Wenzhao; Zhou, Dao; Iannuzzo, Francesco; Hartmann, M.; Blaabjerg, Frede

doi:10.1109/tia.2022.3141034

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Reliability Modeling In Power Electronics and Power Systems1

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Cited by 8 publications

(1 citation statement)

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“…Moreover, power electronic reliability research mostly focuses on modeling the failures originating from internal causes such as wear-out failures due to bond wire lift-off [48] or solder layer failure [49]. However, a power electronic converter may also fail due to external causes, i.e., chance failures, such as an overvoltage due to a lightning strike.…”

Section: Reliability Modeling In Power Electronics and Power Systemsmentioning

confidence: 99%

System-Level Reliability Modeling and Evaluation in Power Electronic-based Power Systems

Davoodi¹

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Section: Reliability Modeling In Power Electronics and Power Systemsmentioning

confidence: 99%

System-Level Reliability Modeling and Evaluation in Power Electronic-based Power Systems

Davoodi¹

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Advantages of the extended finite element method for the analysis of crack propagation in power modules

Nwanoro

Yin

et al. 2023

Power Electronic Devices and Components

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Aging Failure Analysis of IGBT Module Solder Layer Based on Multi-physical Field Coupling

Zhu

Chen

Zhu

et al. 2023

2023 5th Asia Energy and Electrical Engineering Symposium (AEEES)

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Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

Cited by 8 publications

References 34 publications

System-Level Reliability Modeling and Evaluation in Power Electronic-based Power Systems

System-Level Reliability Modeling and Evaluation in Power Electronic-based Power Systems

Advantages of the extended finite element method for the analysis of crack propagation in power modules

Aging Failure Analysis of IGBT Module Solder Layer Based on Multi-physical Field Coupling

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