2023
DOI: 10.1016/j.pedc.2022.100027
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Advantages of the extended finite element method for the analysis of crack propagation in power modules

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Cited by 7 publications
(3 citation statements)
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“…This trend is consistent with the findings in [20], it was reported a similar pattern in their experiments. It is also similar to the reduction in bond shear strength that occurs with increasing crack growth, as reported in [21]. Despite the low value of Vce (less than 5%) shown in Fig.…”
Section: Crack Evolutionsupporting
confidence: 88%
“…This trend is consistent with the findings in [20], it was reported a similar pattern in their experiments. It is also similar to the reduction in bond shear strength that occurs with increasing crack growth, as reported in [21]. Despite the low value of Vce (less than 5%) shown in Fig.…”
Section: Crack Evolutionsupporting
confidence: 88%
“…The depicted results are obtained from a probing point, which is a line/path along the wire bond shown in Fig. 7a, considering the significance of the site [34]. FOM-ANSYS and pROM (Lagrange and Bi-linear) stress results are displayed in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…heat generating source, SiC-based semiconductor, to its opposite side. So, the results show the predicted stresses in the wire body for the considered probing point (line/path), considering the importance of this area [37,38]. Fig.…”
Section: E Resutls and Discussionmentioning
confidence: 98%