2023 5th Asia Energy and Electrical Engineering Symposium (AEEES) 2023
DOI: 10.1109/aeees56888.2023.10114170
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Aging Failure Analysis of IGBT Module Solder Layer Based on Multi-physical Field Coupling

Quanjing Zhu
1
,
Quan Chen
2
,
Liuzhu Zhu
3
et al.
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