“…Secondly, both the normalized "ON" current and SS degrade when NWs are arrayed due to sensitivity of parameters like threshold voltage to, for example, variations in NW width, dielectric thickness, and effective gate length, which could lead to degradation of the SS swing for a large array of devices, especially when considering highly doped source and drain junctions. 22,23 Thirdly and most importantly, the state-of-the-art pitch for vertical NW does not offer high current per unit chip area, as has been shown in the recent demonstrations showing NW pitch in the order of 400 nm for both top down 23 and bottom up approaches. 24 On the other hand, I ON ¼ 100lA/lm at V DD ¼ 1.0 V and V GS ¼ 1 V for all-silicon single gated SOI based TFETs with vertical self-aligned top gate structure supplying and for 70 nm thick SOI with 2 nm effective oxide thickness.…”