To suppress the short‐channel effects (SCEs) and the OFF‐state current (IOFF) and increasing the ON‐state current (ION)/IOFF ratio, the conventional dual‐material double‐gate (DG) junctionless (JL) metaloxide‐semiconductor field effect transistor (MOSFET) is improved by employing the laterally graded channel doping profile and embedding a low‐doped buried layer along the center of the channel. The channel is divided into two regions under the gates and the region near the drain has higher doping level, while the buried layer has lower doping concentration than the channel. The characteristics of the proposed device are modeled analytically, simulated and compared with those of the dual‐material DGJL MOSFETs with uniformly doped and laterally graded doped channels without the buried layer. The results show that because of using the dual‐material gate, the graded doped channel, and the buried layer, the proposed DGJL MOSFET exhibits more improved performance against the SCEs and lower IOFF. The higher electric field near the source and higher carrier velocity along the channel improve the ION and the ION/IOFF ratio of the proposed device, considerably. Also, because of lower subthreshold slope, drain‐induced barrier lowering, and gate capacitance, the proposed device exhibits better switching performance than the other considered structures.