Self-Biased Low Loss Conductor Featured With Skin Effect Suppression for High Quality RF Passives

Iramnaaz, I.; Schellevis, H.; Rejaei, B.; Zhuang, Yan

doi:10.1109/tmag.2012.2200660

Cited by 7 publications

(3 citation statements)

References 19 publications

(17 reference statements)

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“…Then, the low-temperature gold wire bonding has been immediately performed in order to avoid oxidation of the copper and requirement of another metal layer on top of copper for the sake of wire bonding. Electroplating has been selected as the low cost, manufacturing method for the deposition of magnetic/nonmagnetic nanoscopic thin films on radial-shape gold core conductors to ensure conformal coating where most other processes including DC sputtering [7] would be more expensive and might not work best for the radial-shape devices. After performing the multiple-step electroplating of Cu/NiFe, the devices are released by etching the seed layers.…”

Section: Fabrication and Experimental Resultsmentioning

confidence: 99%

Low Ohmic Loss Cylindrical Radial Superlattice Conductors Using Alternatingly Electroplated Magnetic/Nonmagnetic Thin Films for Microwave Applications

Rahimi¹,

Yoon²

2014

2014 Solid-State, Actuators, and Microsystems Workshop Technical Digest

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In this work, the first experimental demonstration of the Cylindrical Radial Superlattice (CRS) conductors made of alternating magnetic/nonmagnetic layers grown on a radial conductor operating in the microwave range is reported. The CRS structure has been employed to force the high frequency current to flow through the volume of the conductor by suppressing the generated eddy currents inside the conductor which will lead to reduction of the conductor loss. Also, the implementation of the highest Q-factor microwave inductor made of the CRS conductor with a Q-factor of 45 at 18 GHz, which is attributed to low conductor and dielectric losses, has been demonstrated.

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Section: Fabrication and Experimental Resultsmentioning

confidence: 99%

Low Ohmic Loss Cylindrical Radial Superlattice Conductors Using Alternatingly Electroplated Magnetic/Nonmagnetic Thin Films for Microwave Applications

Rahimi¹,

Yoon²

2014

2014 Solid-State, Actuators, and Microsystems Workshop Technical Digest

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“…In general, the diameter of the wire can be selected for smaller than two times for the thickness of the skin depth, δ [31][32]. This design guideline can improve the skin effect efficiently.…”

Section: D1 Determine the Diameter Of Wirementioning

confidence: 99%

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Wu¹,

Han

2021

IEEE Access

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The proposed research is to accomplish a converter for driving DC load or AC load with wireless power transfer (WPT) technique. In this novel scheme, a full-bridge LLC resonant converter is adopted to deliver the energy from the primary to the secondary side. Besides, the LLC converter has softswitching characteristic of the switches at the primary to improve the efficiency of the converter if the switching frequency is selected appropriately. In order to achieve the feature of wireless power transfer, the WPT (transmitting/receiving) coils are utilized to replace the transformer. The leakage inductor can be treated as a resonant inductor integrated in the transmitting coil. In the output side, a sinusoidal pulse width modulation (SPWM) technique is added to generate AC voltage for specific load. In other words, the proposed converter can output DC or AC voltage by user's demand. In the end of this research, a LLC converter with WPT technique for 1kW is implemented. The experimental results and the related waveforms are also shown in the content. In this topology, the highest efficiency of DC output is 89.2%, and the highest efficiency of AC output is 82.6% respectively.

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“…5 shows the simulation results of the RSV structure where Cu/NiFe are used as the nonmagnetic/magnetic metal layers. Relatively low magnetization saturation of the NiFe [13] allows designing the RSV to operate in the lower frequency region (up to minimum 5 GHz). The extracted resistance of the radial superlattice conductor using equation (6) has been compared to that of the solid conductor with the same thickness where no laminated structure is used.…”

Section: The Rsv Structure Using Cu/nifementioning

confidence: 99%

Low loss conductors for CMOS and through glass/silicon via (TGV/TSV) structures using eddy current cancelling superlattice structure

Rahimi

Yoon

2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Superlattice structuresconsisting of nonferromagnetic/ferromagnetic metals have been used to create high performance conductors for radio frequency (RF) transmission lines and low loss vias in CMOS and through silicon/glass via (TSV/TGV) structures, whose ohmic resistance and RC delays have been greatly reduced. Two permalloys of Ni80Fe20 and FeCo are studied as the ferromagnetic materials with low and high magnetization saturation that can be used for designing superlattice structures with low and high GHz frequency ranges, respectively. The effects of design parameters including the number of layers and thickness ratio of the superlattice structures have been studied. Full wave simulations have been used to verify them. Finally, a radial superlattice structure consisting of Cu/NiFe layers has been implemented and its resistance has been compared with the control solid-core devices made of copper; proving the effectiveness of the proposed radial superlattice structure for reducing the RF loss. IntroductionThe operation frequency of monolithic integrated circuits has been growing up and reaching the GHz range in modern communication and consumer electronic applications and the clock frequency of today's microprocessors has reached 3 GHz and tends to move to higher frequencies [1]. One of the limiting factors of the high frequency operation is the radio frequency (RF) loss including the dielectric and conductor loss which are associated with devices and circuits operating in the RF range. The mentioned losses together with the inherent parasitic capacitance in those circuits result in the so called RC time delay, preventing the operating frequencies from going higher. The dielectric loss would be reduced by locally removing the dielectric materials forming air-lifted architectures ([2-3]) or using very low loss dielectric materials [4]. Meantime, most electrodes or interconnectors are adopting copper as a conducting material because of its low electrical resistivity, ease of deposition and moderate cost. However, in higher frequencies, its higher conductivity is not as effective and beneficial as it is in the low frequency and DC operation because of the skin effect, where most current is confined in the outermost surface of the conductor and therefore the volume of the conductor is underutilized. As a result, the effective cross section is reduced in RF frequencies and the resistance and conductor loss are increased. Therefore, the high frequency interconnects, transmission lines and vias in a standard CMOS process and in through silicon/glass via (TSV/TGV) structures suffer from large conductor loss. The larger conductor loss will also be significant in high speed digital circuits including analog-to-digital/digital-to-analog converters and processors

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Self-Biased Low Loss Conductor Featured With Skin Effect Suppression for High Quality RF Passives

Cited by 7 publications

References 19 publications

Low Ohmic Loss Cylindrical Radial Superlattice Conductors Using Alternatingly Electroplated Magnetic/Nonmagnetic Thin Films for Microwave Applications

Low Ohmic Loss Cylindrical Radial Superlattice Conductors Using Alternatingly Electroplated Magnetic/Nonmagnetic Thin Films for Microwave Applications

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Low loss conductors for CMOS and through glass/silicon via (TGV/TSV) structures using eddy current cancelling superlattice structure

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