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Glass microdevices for capillary electrophoresis (CE) gained a lot of interest in the development of micrototal analysis systems (microTAS). The fabrication of a microTAS requires integration of sampling, chemical separation and detection systems into a microdevice. The integration of a detection system into a microchannel, however, is hampered by the lack of suitable microfabrication technology. Here, a microfabrication method for integration of insulated microelectrodes inside a leakage-free microchannel in glass is presented. A combination of newly developed technological approaches, such as low-temperature glass-to-glass anodic bonding, channel etching, fabrication of buried metal interconnects, and deposition of thin plasma-enhanced chemical vapour deposition (PECVD) silicon carbide layers, enables the fabrication of a CE microdevice with an integrated contactless conductivity detector. The fabrication method of this CE microdevice with integrated contactless conductivity detector is described in detail. Standard CE separations of three inorganic cations in concentrations down to 5 microM show the viability of the new microCE system.

Abstract-A novel silicon-on-glass integrated bipolar technology is presented. The transfer to glass is performed by gluing and subsequent removal of the bulk silicon to a buried oxide layer. Low-ohmic collector contacts are processed on the back-wafer by implantation and dopant activation by excimer laser annealing. The improved electrical isolation with reduced collector-base capacitance, collector resistance and substrate capacitance, also provide an extremely good thermal isolation. The devices are electrothermally characterized in relationship to different heat-spreader designs by electrical measurement and nematic liquid crystal imaging. Accurate values of the temperature at thermal breakdown and thermal resistance are extracted from current-controlled Gummel plot measurements.

Abstract-A measurement system comprised of an ultra-low-distortion function generator, lock-in amplifier, and semiconductor parameter analyzer is used for sensitive extraction of the smallsignal thermal impedance network of bipolar devices and circuits. The extraction procedure is demonstrated through measurements on several silicon-on-glass NPN test structures. Behavioral modeling of the mutual thermal coupling obtained by fitting a multipole rational complex function to measured data is presented.

Abstract-This paper presents a novel silicon micromachining method, which combines tetra methyl ammonium hydroxide (TMAH) etching and deep-reactive ion etching (DRIE) along with bottom-up copper electroplating, to fabricate high-density and high-aspect ratio through-wafer electrical interconnects (TWEIs) for three-dimensional multichip packaging. The silicon wafer was locally etched with TMAH from the backside until the desired membrane thickness was reached, and then DRIE was performed on the membrane until the holes were etched through. TMAH etching preserved large areas of the wafers at the original thickness, thus, ensuring relatively strong mechanical strength and manipulability. DRIE made it possible to realize high-aspect ratio holes with minimized wafer area consumption. A new bottom-up copper electroplating technique was developed to fill the high-aspect ratio through-wafer holes. This method can avoid seams and voids while achieving attractive electrical features. Through-wafer holes, as small as 5 m in diameter, have been realized by using the combination of TMAH and DRIE, and have been completely and uniformly filled by using bottom-up copper electroplating.Index Terms-Copper electroplating, deep-reactive ion etching (DRIE), interconnect, packaging, through-wafer, tetra methyl ammonium hydroxide (TMAH).

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