Selective ablation of thin films with short and ultrashort laser pulses

Laser patterning of P2 interconnect via in thin-film CIGS PV modules

“…Recent developments in laser technology, with systems that are capable of producing shorter and shorter laser pulses have prompted further investigation. Successful results were achieved for scribing of CIS with pico-and femtosecond lasers which have the advantage of minimizing the heat conduction during the pulse and thus the heat affected zone at the edges [4,5].…”

Functional multilayered capacitor pixels printed by picosecond laser-induced forward transfer using a smart beam shaping technique

“…The irradiated area on the donor layer is made with a combination of beams from masks 1 and 2, as it will further be shown. Both masks were produced by laser micromachining [23] of titanium foil (25 μm thickness, 99.6% purity, supplied by GoodFellow Inc.) in a vacuum chamber (7 · 10 -5 mbar), by using an achromatic lens (700-1100 nm spectral range, 50 mm focal length) and a femtosecond pulsed laser (Spectraphysics, model "Hurricane", 800 nm wavelength, 100 femtosecond pulse duration, 1 mJ/pulse @ 1 kHz repetition rate) [24][25][26][27][28][29][30]. The scan/drill speed was set at ~10 μm/s, with automatic computer control of the positioning system; the size of the resulting masks is 2 x 2 mm 2 .…”

Ultrashort Laser Pulses Machining

“…Layers as thin as a few hundreds of nanometers can be removed by each laser shot, and the process can be repeated up to the point where all the unwanted material is removed and the substrate is stricken by the laser beam. This process can be a precise and useful tool in many applications [80][81][82][83][84], as cleaning, restoration of art objects, decontamination and decoating of cutting tools.…”