Segmented ion-trap fabrication using high precision stacked wafers

Abstract

We describe the use of laser-enhanced etching of fused silica in order to build multi-layer ion traps. This technique offers high precision of both machining and alignment of adjacent wafers. As examples of designs taking advantage of this possibility, we describe traps for realizing two key elements of scaling trapped ion systems. The first is a trap for a cavity-QED interface between single ions and photons, in which the fabrication allows shapes that provide good electro-static shielding of the ion from charge build-up on the mirror surfaces. The second incorporates two X-junctions allowing two-dimensional shuttling of ions. Here we are able to investigate designs which explore a trade-off between pseudo-potential barriers and confinement at the junction center. In both cases we illustrate the design constraints arising from the fabrication. arXiv:1907.05329v1 [physics.app-ph]

Generation of a maximally entangled state using collective optical pumping

“…The heating rate observed in this trap is particularly high, exceeding levels observed in cryogenic traps with comparable ion-electrode distances by a factor of ≈ 100 [44,45]. Reducing it to more typical levels, combined with better shielding of nearby dielectrics [46,47], would suppress drifts within each collective pumping sequence and hence allow the protocol to reach its true steady state. Alternatively, motional mode temperature could be stabilized throughout the protocol by sympa-thetic cooling [48].…”

Probing surface charge densities on optical fibers with a trapped ion

“…Such fields have been found to be correlated to ion heating [15]. Efforts are also underway to integrate optical elements required to address ions with laser beams [21], to collect ions' fluorescence [20,23,27], or to build fiber-based cavities [25,44]. While these elements are fixed with respect to the ion trap, more complex future tasks, such as selective addressing or imaging, may benefit from movable mirrors, lenses, fibers, or waveguides placed close to ions.…”

Engineering of microfabricated ion traps and integration of advanced on-chip features

“…Furthermore, fabrication processes have been optimised for specific capabilities, such as extremely high breakdown voltage [26], [105] or entire shielding of dielectric sidewalls [95]. 3D quadrupole traps have also been fabricated using new techniques which allow for large ion-electrode distances (hence low motional heating rate) for a lower trap drive voltage than surface ion traps [29], [106]. Ref.…”

“…surface ion traps[29],[106]. Eltony et al[107] used a transparent material, indium tin oxide (ITO), as the electrode layer to detect fluorescence emitted from ions with a photodetector underneath the electrode on the backside of the trap chip.…”