2020
DOI: 10.1103/physrevlett.124.095702
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Secondary-Phase-Assisted Grain Boundary Migration in CuInSe2

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Cited by 5 publications
(4 citation statements)
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“…The Cu-Se phase at grain boundaries plays an important role in grain growth in CIGS thin films [63] (see section 3.3). We hypothesize that because Cu-Se can penetrate deep into CIS layers (owing to better lattice match with CIS) but remains on the surface of CGS layers [64], the annihilation of stacking faults is more effective and thus the defect density is lower for CIS than for CGS [65].…”
Section: Point Defects In Cigsmentioning
confidence: 99%
See 1 more Smart Citation
“…The Cu-Se phase at grain boundaries plays an important role in grain growth in CIGS thin films [63] (see section 3.3). We hypothesize that because Cu-Se can penetrate deep into CIS layers (owing to better lattice match with CIS) but remains on the surface of CGS layers [64], the annihilation of stacking faults is more effective and thus the defect density is lower for CIS than for CGS [65].…”
Section: Point Defects In Cigsmentioning
confidence: 99%
“…Recent complementary in situ STEM studies of the secondstage transition from copper-deficient CIS to a copper-rich material [63,158] clearly demonstrate that grain boundaries migrate during heating. Grains with lower planar defect densities consume those with more defects.…”
Section: Reactive Codeposition Absorber Synthesismentioning
confidence: 99%
“…The transition may result in an increase in average grain size and the annihilation of defects. [25,26] In contrast, the solution-processed chalcopyrite film is achieved by coating a precursor solution (which includes Cu, In, Ga, and S/Se source), followed by an annealing and selenization process. [27] The chalcopyrite phase is directly formed during the thermal annealing process due to the chemical reaction in the precursor solution.…”
Section: Introductionmentioning
confidence: 99%
“…[ 6 ] The Cu‐poor/Cu‐rich transition is accompanied by structural and morphological changes that include an increase in grain size, recrystallization (stress relaxation), and a decrease in stacking fault density and planar defects. [ 8 ] In 2019, Feurer et al reported that Urbach energies decreased from ≈20 to 16 meV by increasing the Cu concentration in the absorber films (from [Cu]/[In] ≈ 0.88 to 0.95).7 Record PCEs of 19.2% were demonstrated for CISSe devices with a near stoichiometric absorber composition, having an external quantum efficiency (EQE) determined minimum bandgap ( E g ) of 1.0 eV. Notably, however, in terms of film processing, the absorber growth process for vacuum‐ and IDR‐based absorbers is fundamentally different, i.e., a single‐step deposition (elemental evaporation rates and substrate temperature are adjusted to tailor grain growth and bandgap gradients) versus two‐step process (nearly all the constituent elements (Cu, In, and S/Se) mixed in atomic compositions, deposited, and thermally treated in a chalcogen environment for grain growth).…”
Section: Introductionmentioning
confidence: 99%