“…In a CMOS process, aluminum that is often used as a top metal is oxidized over time, which can disrupt the electrical interface with biological tissue, as one example [ 8 , 9 ]. For this problem, stable and biocompatible alternative materials such as gold (Au), platinum–iridium alloy, and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) are attractive to provide long-term reliability of the electrode–tissue interface and electrode–electrolyte impedance optimization [ 19 , 20 , 21 , 22 , 23 , 24 ]. One post-CMOS strategy has made use of the sacrificial carrier substrate accompanying the bare die that holds the individual microdevices, using deep-etched silicon, silicon oxide substrate [ 25 , 26 , 27 ], or rigid polymer [ 5 , 6 , 28 , 29 , 30 ].…”