2017
DOI: 10.1039/c7nr02915b
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Scalability of voltage-controlled filamentary and nanometallic resistance memory devices

Abstract: Much effort has been devoted to device and materials engineering to realize nanoscale resistance random access memory (RRAM) for practical applications, but a rational physical basis to be relied on to design scalable devices spanning many length scales is still lacking. In particular, there is no clear criterion for switching control in those RRAM devices in which resistance changes are limited to localized nanoscale filaments that experience concentrated heat, electric current and field. Here, we demonstrate… Show more

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Cited by 33 publications
(20 citation statements)
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“…40 Table 1 compares the ON/OFF ratio, the endurance cycle, the linearity, the weight update error rate of potentiation and depression, and the read margin for the three types of switching. The Pt/HfAlO x /TiN device shows good stability as well as multilevel and tunable switching based on different measurement conditions such as CC, 42 bias polarity, and voltage sweep range, 43 which are explained in the ow chart presented in the inset in Fig. 9.…”
Section: Resultsmentioning
confidence: 98%
“…40 Table 1 compares the ON/OFF ratio, the endurance cycle, the linearity, the weight update error rate of potentiation and depression, and the read margin for the three types of switching. The Pt/HfAlO x /TiN device shows good stability as well as multilevel and tunable switching based on different measurement conditions such as CC, 42 bias polarity, and voltage sweep range, 43 which are explained in the ow chart presented in the inset in Fig. 9.…”
Section: Resultsmentioning
confidence: 98%
“…Regardless of the type, simple methods can help clarify ReRAM characteristics-pressure tests to detect nonionic switching and fracture tests to confirm filamentary switching. Finally, methods are now available to remove the load effect to reveal the true voltage, 14,16 area, 14 temperature, and magnetic-field scaling 8,17 in these two-terminal devices.…”
Section: Discussionmentioning
confidence: 99%
“…After the SET process, charge carriers flowed through the conduction filament (CF) instead of the whole device area in the LRS. After the RESET process, current contribution is dominated by thermally activated localized states at the partially ruptured filaments and not by the bulk layer [23][24][25][26][27].…”
Section: Area Dependencymentioning
confidence: 99%