Rotating disc and hemispherical electrodes for copper dissolution study in hydrochloric solution in the presence of benzotriazole

Matos, Jaqueline Borges; D’Elia, Eliane; Barcia, Oswaldo E.; Mattos, O.R.; Pébère, Nadine; Tribollet, Bernard

doi:10.1016/s0013-4686(00)00719-2

Cited by 34 publications

(13 citation statements)

References 26 publications

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“…In the Bode phase plots ( Figure 3 c), two-time constants are present. The loop observed at low frequency (LF) was attributed to the mass transfer and that at the intermediate frequency was linked to the R ct and double layer capacitance, as was reported by other authors [ 46 ]. The incomplete capacitive loop observed at high frequency is due to the non-homogeneous current distribution on the electrode surface.…”

Section: Resultssupporting

confidence: 62%

Combined Experimental and Theoretical Insights into the Corrosion Inhibition Activity on Carbon Steel Iron of Phosphonic Acids

et al. 2020

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The inhibition effect of N,N′-phosphonomethylglycine (PMG) and vinyl phosphonic acid (VPA) on the 3% NaCl acidic solution corrosion of carbon steel iron was studied at different immersion times by potentiodynamic polarization, electrochemical impedance spectroscopy, attenuated total reflectance Fourier transform infrared (ATR-FTIR) spectroscopy, and computational methods. It is found from the polarization studies that PMG and VPA behave as mixed-type inhibitors in NaCl. Values of charge transfer resistance (Rct) and double layer capacitance (Cdl) in the absence and presence of inhibitors are determined. The PMG and VPA inhibitors were capable of inhibiting the corrosion process up to ≈91% and ≈85%, respectively. In the presence of PMG, the synergic effect of chlorine ions was observed. Density functional theory (DFT) was engaged to establish the adsorption site of PMG, VPA, and their deprotonated states. For studied compounds, the resulted values of ELUMO, EHOMO, energy gap (∆E), dipole moment (μ), electronic hardness (η), global softness (σ), electrophilic index (ω), and the electronic potential map are in concordance with the experimental data results regarding their corrosion inhibition behavior and adsorption on the metal surface.

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Section: Resultssupporting

confidence: 62%

Combined Experimental and Theoretical Insights into the Corrosion Inhibition Activity on Carbon Steel Iron of Phosphonic Acids

et al. 2020

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“…Anodic charge transfer resistances were also obtained from LSV results, assuming a pure kinetic control in the anodic part and using corrosion currents deduced graphically at the intersection of the tangent line to the anodic branch of the logarithmic i-E curve with the vertical line corresponding to E corr , according to Eq. 13: R a ct = b a 2.303 × i corr [13] where b a is the anodic Tafel slope measured from the LSV curves. R a ct , I corr and b a values are gathered in Table III.…”

Section: Resultsmentioning

confidence: 99%

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

Mirhashemihaghighi

Światowska

Maurice

et al. 2015

J. Electrochem. Soc.

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Corrosion protection by ultra-thin (≤ 50 nm) alumina films deposited by atomic layer deposition (ALD) on copper at 250 • C was studied in 0.5 M NaCl aqueous solution by combining electrochemical and surface analytical methods. Time-of-Flight Secondary Ion Mass Spectrometry revealed a homogenous in-depth stoichiometry of the alumina coatings and their residual bulk contamination by organic and water precursor fragments. Trace contamination by a spurious Cu oxide was evidenced at the interface with the Cu substrate despite a reducing pre-treatment. Atomic force microscopy images revealed conformal substrate coverage and a granularlike coating morphology at the nanometer scale. Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) showed no electrochemical activity of the coating and a corrosion decrease reaching 4 orders of magnitude for coated samples in comparison with bare copper. Uncoated surface fraction was quantified by application of three different methods using the LSV and EIS data which led to results in excellent agreement. The uncoated surface fraction for 50 nm Al 2 O 3 layers was ∼0.01%, confirming ALD alumina as an excellent coating for corrosion protection with spectacularly low residual corrosion activity restricted to the bottom of channel defects connecting the substrate to environment through the coating.Copper is an important engineering metal and finds widespread application in heat exchangers, electrical power lines, water utilities, oil refineries, marine environments and microelectronics owing to its high electrical and thermal conductivity and mechanical workability. 1-3 Many studies have been dedicated to the copper corrosion mechanisms, especially in presence of aggressive ions like chloride, 4-8 and various corrosion protection methods have been explored including coating techniques such as Chemical Vapor Deposition (CVD), 9,10 plasma deposition 11 or electrochemical polymerization, 12 and the use of inhibitors 13-16 or self-assembled monolayers. 17,18 In the present study, Atomic Layer Deposition (ALD) of ultra-thin (≤ 50 nm) alumina coatings has been investigated for the corrosion protection of copper. ALD, as a CVD derived method, is an ideal technique for growing high quality nanometer-thick films. It takes advantage of sequential precursor pulsing on the substrate with selflimiting saturative steps to produce conformal films with accurate thickness control. As a result of excellent step-coverage on even difficult substrate surfaces with high aspect ratios, the grown films tend to be conformal and pinhole-free. [19][20][21][22] Alumina (Al 2 O 3 ) was chosen as a well-behaved and thoroughly-studied ALD material by virtue of its high dielectric properties, good adhesion to many surfaces, amorphous structure, thermal stability and mechanical properties. 21,23-25 ALD alumina for corrosion protection has already been studied alone and/or in combination with titania on stainless steel, 23,26-28 Mg alloy, 29 Al alloy, 30 silver 31,32 and copper. 33-36 Nanolamina...

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“…Ongoing efforts have been done in the attempt of preventing the copper electrodissolution in chloride media, in which CuCl/CuCl 2 − and Cu 2 O species are commonly formed . The use of this metal in seawater distribution and thermal exchange systems makes the issue more interesting because appreciable amounts of chloride are found in the former, whereas the second system is cleaned from time to time by the acid pickling process using HCl.…”

Section: Introductionmentioning

confidence: 99%

On the 4‐methylimidazole behavior at a copper electrode: A view from surface‐enhanced Raman scattering

Silva¹,

Wysard

Bandeira³

et al. 2019

J Raman Spectroscopy

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Surface enhanced raman scattering (SERS) spectra of 4‐methylimidazole (4‐MeImid) are shown for the first time on a copper electrode and in the presence of chloride. The potential dependence on the spectra reveals that the N1H tautomer is majority close to the open circuit, but the N3H tautomer predominates at more cathodic polarizations. At these latter conditions, 4‐MeImid orientation changes from tilted to perpendicular, and such a behavior is similar to the one of Imid at natural pH. Interesting issues are observed at pH = 2.0: (a) 4‐MeImidH+ is not identified on the metal surface for the whole applied potential range and must be either adsorbed as an ion pair with chloride or in the bulk solution; (b) at open circuit and anodic polarization, its neutral form is the unique azole species present, in contrast to the ImidH+ behavior, which is easily observed in the surface spectra.

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Rotating disc and hemispherical electrodes for copper dissolution study in hydrochloric solution in the presence of benzotriazole

Cited by 34 publications

References 26 publications

Combined Experimental and Theoretical Insights into the Corrosion Inhibition Activity on Carbon Steel Iron of Phosphonic Acids

Combined Experimental and Theoretical Insights into the Corrosion Inhibition Activity on Carbon Steel Iron of Phosphonic Acids

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

On the 4‐methylimidazole behavior at a copper electrode: A view from surface‐enhanced Raman scattering

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