Room temperature creep of Ti-6AI-4V

Imam, M. Ashraf; Gilmore, C. M.

doi:10.1007/bf02697068

Cited by 46 publications

(23 citation statements)

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“…The presence of significant creep at an ambient temperature in titanium alloys was reported in Ti-5Al-2.5Sn alloy 1) and Ti-6Al-4V alloy 2,3) in the 1960s. However, the study did not continue except those of Ti-6Al-2Cb-1Ta-1Mo alloy 4) and Ti-0.4Mn alloy 5) at around 1990.…”

Section: Introductionmentioning

confidence: 87%

Categorization of ambient temperature creep behavior of metals and alloys on their crystallographic structures

Satô

Yamada

Tanaka

et al. 2005

J. Japan Inst. Light Metals

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The creep behavior at an ambient temperature of typical h.c.p., b.c.c. and f.c.c. metals and alloys of annealed states were surveyed. Cubic metals and alloys demonstrated negligible creep strain under all stress ranges. In contrast, h.c.p. metals and alloys demonstrated significant creep behavior. In particular, Ti-6Al-4V alloy and CP-Ti metal showed accumulated large creep strains. The difference among metals and alloys were negligible, for Mg and Zr. After being cold rolled, Ti-6Al-4V alloy and CP-Ti metal showed less significant creep behavior.

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Section: Introductionmentioning

confidence: 87%

Categorization of ambient temperature creep behavior of metals and alloys on their crystallographic structures

Satô

Yamada

Tanaka

et al. 2005

J. Japan Inst. Light Metals

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“…Since that time, several studies of this phenomenon have been carried out using Ti alloys. Several Ti alloys were investigated in the 1960s and 70s such as Ti-5Al-2.5Sn (Kiefer & Schwartzberg, 1967;Thompson & Odegard, 1973) and Ti-6Al-4V (Reiman, 1971;Odegard & Thompson, 1974;Imam & Gilmore, 1979). Later, Mills' group intensively studied this phenomenon using Ti-6Al and Ti-6Al-2Sn-4Zr-2Mo (Suri et al, 1999;Neeraj et al, 2000;Deka et al, 2006).…”

Section: Introductionmentioning

confidence: 99%

Estimation of Grain Boundary Sliding During Ambient-Temperature Creep in Hexagonal Close-Packed Metals Using Atomic Force Microscope

Matsunaga¹,

Satô²

2012

Scanning Probe Microscopy-Physical Property Characterization at Nanoscale

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“…It has been revealed that several Ti alloys show significant creep behaviour at ambient temperature [1][2][3][4][5][6]. These works reported two types of deformation mechanisms: a planner slip in α-grains [1][2][3]5]; time-dependent deformation twins [4].…”

Section: Introductionmentioning

confidence: 99%

“…These works reported two types of deformation mechanisms: a planner slip in α-grains [1][2][3]5]; time-dependent deformation twins [4]. Thompson et al [1] evaluated apparent activation energy (Q) of 37 kJ/mol as dislocations overcame interstitial atoms.…”

Section: Introductionmentioning

confidence: 99%

“…the ambient-temperature creep region [8], into the Ashby-type deformation mechanism map of annealed CP-Ti [9], where the Q value was 10 kJ/mol. According to these previous works [1][2][3][4][5][6][7][8], the deformation and the rate-controlling mechanism of ambient- Creep tests were conducted in tension at temperatures from 203 K to 873 K with loads of 0.5-0.9σ 0.2 . The loading direction is parallel to the rolling direction in the both tests.…”

Section: Introductionmentioning

confidence: 99%

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New creep region and mechanism in hexagonal close-packed metals

Matsunaga

Kameyama

Ueda

et al. 2010

J. Phys.: Conf. Ser.

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Abstract. Only hexagonal close-packed (h.c.p.) materials show creep behaviour significantly at ambient temperature or less even below their 0.2% proof stresses with their stress exponents of 3.0 and their apparent activation energies of 20 kJ/mol. Transmission electron microscopy revealed dislocation arrays as a planar slip without any tangled dislocations inside each grain. Atomic force microscopy and electron backscatter diffraction pattern analyses brought about the occurrence of grain boundary sliding. The grain-size exponent was evaluated as 1.0, which means grain boundaries work as the barrier of the dislocation motion. Ambient-temperature creep of h.c.p. materials is schematically illustrated as that lattice dislocations move inside each grain without any obstacles and then pile up at grain boundaries. To continue the creep deformation, these dislocations are absorbed by grain boundaries to accommodate the internal stress and lead to grain boundary sliding.

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Room temperature creep of Ti-6AI-4V

Cited by 46 publications

References 1 publication

Categorization of ambient temperature creep behavior of metals and alloys on their crystallographic structures

Categorization of ambient temperature creep behavior of metals and alloys on their crystallographic structures

Estimation of Grain Boundary Sliding During Ambient-Temperature Creep in Hexagonal Close-Packed Metals Using Atomic Force Microscope

New creep region and mechanism in hexagonal close-packed metals

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