Abstract:Abstract. Only hexagonal close-packed (h.c.p.) materials show creep behaviour significantly at ambient temperature or less even below their 0.2% proof stresses with their stress exponents of 3.0 and their apparent activation energies of 20 kJ/mol. Transmission electron microscopy revealed dislocation arrays as a planar slip without any tangled dislocations inside each grain. Atomic force microscopy and electron backscatter diffraction pattern analyses brought about the occurrence of grain boundary sliding. The… Show more
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