Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films

Ishii, Mieko; Kon, Hitoe; Uomoto, Miyuki; Nakaya, Takayuki; Shimatsu, T.

doi:10.1109/ltb-3d.2014.6886166

Cited by 3 publications

(1 citation statement)

References 1 publication

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“…22) If the electroplated rough Au surface is smoothed at the atomic level, such smoothed Au surfaces can form intimate contact with each other at room temperature. 23,24) Therefore, we have demonstrated two smoothing processes for an electroplated Au seal ring surface. One is surface smoothing by the thermal imprint method using a smooth substrate as a master mold.…”

Section: Introductionmentioning

confidence: 99%

Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

Kurashima

Maeda

Takagi

2015

Jpn. J. Appl. Phys.

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We evaluated room-temperature bonding characteristics of electroplated Au surfaces smoothed by the lift-off and imprint methods. As a result, we found that smoothed surfaces enable strong bonding; on the other hand, electroplated rough surfaces result in very weak bonding. In transmission electron microscopy observations, no delamination was observed at the bonding interface bonded at room temperature using a smooth surface prepared by the lift-off method. Moreover, the hermeticity of the bonding interface prepared using smoothed surfaces was evaluated using diaphragm structures. As a result, we confirmed that good hermetic sealing was achieved using the electroplated Au surface smoothed by the lift-off method.

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Section: Introductionmentioning

confidence: 99%

Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

Kurashima

Maeda

Takagi

2015

Jpn. J. Appl. Phys.

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Room-temperature Au–Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns

Kurashima

Matsumae

Takagi

2018

Microelectronic Engineering

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Shear strength of room-temperature-bonded sapphire and metal substrates using Au films

Kon¹,

Uomoto

Nakajima³

et al. 2017

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films

Abstract: Room temperature bonding of sapphire-sapphire and sapphire-metal substrates was achieved in Air using Au films. This bonding technique can support expansion of the potential applications of sapphire in diverse industries.

Cited by 3 publications

References 1 publication

Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

Room-temperature Au–Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns

Shear strength of room-temperature-bonded sapphire and metal substrates using Au films

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