2023
DOI: 10.1007/s00339-023-06400-y
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Role of wet chemical saw damage removal process in texturing of c-Si and performance of a-Si:H/c-Si heterojunction solar cells

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Cited by 4 publications
(2 citation statements)
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“…The p-a-Si:H and nickel oxide (NiO x ) based hole-selective contact SHJ cells were fabricated using as-cut (100) oriented n-type float-zone crystalline silicon wafers having a resistivity of 2-3 Ω cm, ∼250 µm thickness, and ∼2 ms bulk lifetime. The wafers' saw damage was removed using ∼30 wt.% of NaOH solution at ∼85 • C for 10 min [31]. The wafers were cleaned by adopting the standard Radio Corporation of America (RCA) cleaning procedure.…”
Section: Methodsmentioning
confidence: 99%
“…The p-a-Si:H and nickel oxide (NiO x ) based hole-selective contact SHJ cells were fabricated using as-cut (100) oriented n-type float-zone crystalline silicon wafers having a resistivity of 2-3 Ω cm, ∼250 µm thickness, and ∼2 ms bulk lifetime. The wafers' saw damage was removed using ∼30 wt.% of NaOH solution at ∼85 • C for 10 min [31]. The wafers were cleaned by adopting the standard Radio Corporation of America (RCA) cleaning procedure.…”
Section: Methodsmentioning
confidence: 99%
“…The crystallinity (Xc) was extracted by deconvoluting the microcrystalline Raman peaks at ∼520 cm −1 To study the growth of nanocrystalline films, the substrate is also quite crucial for the nucleation phase, controlling the film crystallinity and the growth axis. Prior to PECVD deposition, the as-cut n-type c-Si wafers were first cleaned in piranha solution (H 2 SO 4 : H 2 O 2 in 3:1 ratio) to remove the organic contaminants from the surface followed by saw damage removal in 30 wt% NaOH solution for 10 min [15]. The wafers were then textured in 2 wt% KOH solution with Mono-TEX as an additive for 20 min to obtain an average pyramid size of ∼2 μm.…”
Section: Deposition Of Phosphorous Doped Nc-si:h Thin Film and Its Ch...mentioning
confidence: 99%