Role of stress triaxiality on performance of solder joints with different geometries

Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

“…Although the stress alteration at this level is significantly lower than Levels 1 and 2, the main creep strain value may be related to this level. This is because of the high temperature of hot dwell time, inducing creep deformation even at the low stress changes (Jayabalan et al , 2019). Level 4 is consistent with the cooling stage at the thermal cycle, leading to a sharp stress change in the interconnection.…”

Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

“…Hereafter, strain energy or strain energy per volume in the solder joint is associated to the solder joint volume as shown in Figure 3(b). Mesh size was optimized using the ABAQUS software optimization tool (Jayabalan et al , 2019). The behaviors of various solder joints under temperature swing based on JESD22-A105C (JEDEC, 2011) were monitored and discussed using several FEM simulations.…”

Role of alternating current shape on microstructure and damage evolution of solder joints

“…In fact, the integration of electronic modules comes at the expense of accelerated damage evolution in their vulnerable electronic parts, especially solder joints [5][6][7]. Thermal cycling, vibrational frequencies, electric current effects and harsh environmental situations are factors influencing reliability of solder joints [8][9][10][11][12][13]. Among them, the electric current with different failure mechanisms plays a significant role on the solder degradation.…”