2019
DOI: 10.1039/c9ra03560e
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Role of polysilicon in poly-Si/SiOxpassivating contacts for high-efficiency silicon solar cells

Abstract: The efficiency of silicon solar cell with poly-Si/SiOx passivating contact was improved by etching of poly-Si which improves short circuit current density without affecting passivation quality and fill factor.

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Cited by 40 publications
(20 citation statements)
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“…Hence, the grain size was increased by annealing, which indicates that the increase in the grain size of the poly‐Si layer may have an influence on the increase in the lifetime, due to the reduced recombination at the grain boundary region . In addition, because the recombination is critically affected by the silicon oxide layer and, as shown in recent research, this layer does not allow the recombination from bulk to grain, the increased lifetime may be caused by improvement of the silicon oxide layer . From a comparison of the POCl 3 ‐doped poly‐Si and in situ P‐doped poly‐Si, it was found that the in situ P‐doped poly‐Si had a larger grain size after annealing.…”
Section: Resultsmentioning
confidence: 89%
See 1 more Smart Citation
“…Hence, the grain size was increased by annealing, which indicates that the increase in the grain size of the poly‐Si layer may have an influence on the increase in the lifetime, due to the reduced recombination at the grain boundary region . In addition, because the recombination is critically affected by the silicon oxide layer and, as shown in recent research, this layer does not allow the recombination from bulk to grain, the increased lifetime may be caused by improvement of the silicon oxide layer . From a comparison of the POCl 3 ‐doped poly‐Si and in situ P‐doped poly‐Si, it was found that the in situ P‐doped poly‐Si had a larger grain size after annealing.…”
Section: Resultsmentioning
confidence: 89%
“…47 In addition, because the recombination is critically affected by the silicon oxide layer and, as shown in recent research, this layer does not allow the recombination from bulk to grain, the increased lifetime may be caused by improvement of the silicon oxide layer. [53][54][55] From a comparison of the POCl 3 -doped poly-Si and in situ P-doped poly-Si, it was found that the in situ P-doped poly-Si had a larger grain size after annealing. This indicates that the in situ P-doped poly-Si can achieve a higher passivation quality than the POCl 3 -doped poly-Si, due to the larger grain size with low in-diffusion and a higher doping concentration, which improves the passivation quality and contact property.…”
Section: Methodsmentioning
confidence: 99%
“…To further improve the chemical passivation of SiO x , hydrogenation treatment is commonly applied. The passivation quality of poly-Si/SiO x structures is sensitive to the hydrogen content around the SiO x interfacial layer. , The crystalline silicon (c-Si)/SiO x interface state density ( D it ) has been shown to be reduced by injecting hydrogen, , which can be achieved via forming gas anneal (FGA) , or by coating with a hydrogen-rich layer, such as silicon nitride (SiN x ) or aluminum oxide (AlO x ), , followed by thermal annealing.…”
Section: Introductionmentioning
confidence: 99%
“…The higher doping causes a reduced interfacial recombination as the minority carriers’ concentration is smaller. [ 31,32 ] This reduces the surface recombination velocity and thus passivation quality is higher for Group—POCl 3 than for Group—Im15.…”
Section: Resultsmentioning
confidence: 99%