Rigorous and simplified models for the capacitance of a circularly symmetric via

Abstract

An integral-equation method is presented for analyzing the capacitance of circularly symmetric vias with thick conductors and conical posts. From the numerical data, simple expressions are derived which account for the effect of conductor thickness and cone angle. Use of the approximate expressions allows one to accurately determine via capacitance while using a simpler thin-conductor straight-post via model.

Optimization and Design of Passive Link with Single Channel 25 Gbps Based on High-Speed Backplane

“…At the same time, the parasitic capacitance and inductance introduced by via parasitic effect will also lead to reflection and scattering in the process of signal transmission, which will affect the performance of the link. Therefore, the research on the characteristics of vertical interconnected vias is not only of great significance to the simulation and design of multilayer circuit board, but also can better guide the analysis of signal integrity in high-speed digital circuits [25][26][27][28].…”

Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

“…HD-PCB structures consist of several metal layers separated by dielectric substrates. The vias and microvias used in multilayer PCBs allow connecting lines of different metallic levels together or connecting devices to the power and ground plane [5]. The different metal planes can also be connected together with metallic plated through holes (PTHs).…”

Quasi‐static parameters, low‐frequency solutions, and full‐wave solutions of a single‐layered via

“…To study the via discontinuity, a host of methods have been developed [1][2][3][4][5][6][7][8][9][10]. Most of them treat the via as two types: the via through one PEC ground planes [3][4][5][6][7] and the via through the two PEC ground/power planes [8 -10]. For the via through one single PEC plane, the quasi-static approach is used to extract the lumped capacitance and inductance [3][4][5][6].…”

“…Most of them treat the via as two types: the via through one PEC ground planes [3][4][5][6][7] and the via through the two PEC ground/power planes [8 -10]. For the via through one single PEC plane, the quasi-static approach is used to extract the lumped capacitance and inductance [3][4][5][6]. At high frequency, the full-wave solution is also developed [7] and compared with the quasistatic solution.…”

“…Intensive theoretical and experimental studies of laser systems subject to an external injection have been undertaken, especially in miconductor lasers [1][2][3]. In erbium-doped fiber laser (EDFL) systems, some works have been carried out to investigate the frequency-control characteristics [4], injection locking [5][6][7] and frequency stabilization [6,7]. In previous work [8], the phenomenon of injection locking has been defined as when the systems are forced to oscillate at the frequency of the injected signal.…”