Abstract-Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations.
Wireless Networks-on-Chip (WiNoC) are being explored for parallel applications to improve the performances by reducing the long distance/critical path communications. However, WiNoC still require precise propagation models to go beyond proof of concept and to demonstrate it can be considered as a realistic efficient alternative to wired NoC. In this paper, we present accurate 3D models based on measurements in Ka band and Electromagnetic (EM) simulations of transmission on silicon substrate in the V band and the Sub-THz band. Using these EM results, a time-domain simulation is performed using an On-Off Keying (OOK) modulation based transmission with different PA/LNA configurations. Our results highlight the type of performances and tradeoffs to be considered according to different parameters such as power output and amplifier's gain. By improving the knowledge about the signal propagation, one can conduct precise design space exploration for parallel applications. We discuss the realistic channel modeling and we present also hybrid solutions and associated limitations of WiNoC architectures. We conclude the paper with research directions to be explored to make WiNoC a reality.
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