RF-SiP Design and Integration

Bagdasarian, B.; Blonski, J.; Karim, Nozad; Mao, Jingkun

doi:10.1109/apmc.2005.1606517

Cited by 7 publications

(1 citation statement)

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“…Effective fillers have been developed for shielding usage in electronics encapsulation [4]. But for the cost consideration, shielding with a metal cap is still a mainstream solution among many big companies and can be found in many patents [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Analysis on electromagnetic isolation issues among multi-chips in system in package

Liu

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

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Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance with different distances is revealed with ideal antenna simulation results in order to eliminate the parasitic effects. EM isolation properties in different horizontal distances are measured between different chips. Moreover, EM isolation properties in different vertical distances are measured using a structure like a pulley block. This paper also demonstrates EM isolation properties of a shield structure with a metal cap. The test results show the shield efficiency of a metal cap reaches more than 50dB. These results are constituent with the simulation results simulated by HFSS, a 3-dimensional electromagnetic field simulation software.

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Section: Introductionmentioning

confidence: 99%