2010
DOI: 10.1007/s00542-010-1099-4
|View full text |Cite
|
Sign up to set email alerts
|

RF–DC power conversion of Schottky diode fabricated on AlGaAs/GaAs heterostructure for on-chip rectenna device application in nanosystems

Abstract: The Schottky diodes enjoined with coplanar waveguides are investigated for applications in on-chip rectenna device applications without insertion of a matching circuit. The design, fabrication, DC characteristics and RF-to-DC conversion of the AlGaAs/GaAs HEMT Schottky diode is presented. The RF signals are well converted by the fabricated Schottky diodes with cut-off frequency up to 25 GHz estimated in direct injection experiments. The outcomes of these results provide conduit for breakthrough designs for ult… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
6
0

Year Published

2011
2011
2021
2021

Publication Types

Select...
5
1

Relationship

2
4

Authors

Journals

citations
Cited by 6 publications
(6 citation statements)
references
References 11 publications
(9 reference statements)
0
6
0
Order By: Relevance
“…The three parameters of diode, V br , junction capacitance, C j and series resistance, R s determine the power conversion efficiency. We have also shown that the R s should be small enough to operate at higher frequency with high conversion efficiency [ 4 ].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The three parameters of diode, V br , junction capacitance, C j and series resistance, R s determine the power conversion efficiency. We have also shown that the R s should be small enough to operate at higher frequency with high conversion efficiency [ 4 ].…”
Section: Resultsmentioning
confidence: 99%
“…Ideally, such a III–V semiconductor chip should be placed on a Si platform. Recently, we reported the proposal of direct integration of an antenna and a Schottky diode for a RF power detector as well as a rectenna ( rec tified an tenna ) device application to supply direct current (DC) power to generate other on-chip nanodevices [ 3 , 4 ].…”
Section: Introductionmentioning
confidence: 99%
“…The HEMT structures was etched to the SI layer during the process of mesa formation by using a mixture of sulphuric acid, H 2 SO 4 , hydrogen peroxide (H 2 O 2 ) and deionized (DI) water at 25 °C for 18 s. Formation of CPW and the dipole antenna on a SI layer seems to reduce the RF losses as the signal is travelling through the CPW. The details of the materials and the fabrication processes have been described in [ 10 , 15 , 31 ]. Figure 1b shows the top-view photo of the rectenna device.…”
Section: Fabrication Of the Integrated Devicementioning
confidence: 99%
“…The most promising breakthrough to further increase the performance of ULSIs is by introducing new channel materials with higher carrier mobilities than Si, such as gallium arsenide (GaAs) [ 7 , 8 ]. Therefore, co-integration of GaAs on Si should lead to the realization of the so-called advanced heterogeneous integration on a Si platform [ 9 ], where this material is not only used for the fabrication of high speed transistor, but also for the fabrication of other functional devices such as on-chip low power sources [ 10 ], sensors [ 11 , 12 ], optical devices [ 13 ], detectors [ 14 16 ] and solar batteries [ 17 ]. Nowadays, there is extensive research on the growth of GaAs on Si [ 18 – 20 ], which has seemed to accelerate the realization of such technology.…”
Section: Introductionmentioning
confidence: 99%
“…In device based method, rectifiers are implemented by using Schottky diodes [11], zero-threshold transistors [12] and native transistors [13]. These implementations require dedicated manufacturing steps.…”
Section: Introductionmentioning
confidence: 99%