“…The most promising breakthrough to further increase the performance of ULSIs is by introducing new channel materials with higher carrier mobilities than Si, such as gallium arsenide (GaAs) [ 7 , 8 ]. Therefore, co-integration of GaAs on Si should lead to the realization of the so-called advanced heterogeneous integration on a Si platform [ 9 ], where this material is not only used for the fabrication of high speed transistor, but also for the fabrication of other functional devices such as on-chip low power sources [ 10 ], sensors [ 11 , 12 ], optical devices [ 13 ], detectors [ 14 – 16 ] and solar batteries [ 17 ]. Nowadays, there is extensive research on the growth of GaAs on Si [ 18 – 20 ], which has seemed to accelerate the realization of such technology.…”