1998
DOI: 10.1109/4.735544
|View full text |Cite
|
Sign up to set email alerts
|

RF circuit design aspects of spiral inductors on silicon

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
24
0
3

Year Published

2000
2000
2021
2021

Publication Types

Select...
5
4

Relationship

0
9

Authors

Journals

citations
Cited by 198 publications
(27 citation statements)
references
References 10 publications
0
24
0
3
Order By: Relevance
“…3,10 Similar results are encountered in circuit simulation, involving electromagnetic field solvers. 3,10 Similar results are encountered in circuit simulation, involving electromagnetic field solvers.…”
mentioning
confidence: 53%
“…3,10 Similar results are encountered in circuit simulation, involving electromagnetic field solvers. 3,10 Similar results are encountered in circuit simulation, involving electromagnetic field solvers.…”
mentioning
confidence: 53%
“…Here conductors of width w m and thickness t m are separated from a Si substrate of thickness t s by a thin layer of insulator (for example, SiO 2 ) of thickness t Ox . For low frequencies the well-known lumped-element equivalent circuit in figure 3(b) [16,17] can be used. The coil is an inductance L C in series with a resistance R C , and coupled to the substrate by an oxide spacer, represented by the two capacitors C Ox .…”
Section: Equivalent Circuitmentioning
confidence: 99%
“…Q-factors are limited by capacitative coupling through the substrate, which gives rise to an additional lossy parasitic resonance. These problems are well understood in RF IC design [16,17], and have been addressed by undercutting [18]. Table 1 contains a summary of some recent micro-coil performance.…”
Section: Introductionmentioning
confidence: 99%
“…There have been two prior approaches for the enhancement of Q factor; one is to reduce the resistive component of the inductor itself and the other to reduce the parasitic components of the lossy silicon substrate. As for the former approach the material of the metal strip is now shifting from aluminum to lower resistance materials such as copper or silver [3] in pursuit of the leverage of thick metallization [4,5]. As for the latter approach the guard-ring technique [1] that suppresses the parasitic current in silicon substrate was introduced although the shielding effect is questionable from a practical point of view.…”
Section: Introductionmentioning
confidence: 98%