Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Xu, Kai-kai; Zhang, Liang; Gao, Lili; Jiang, Nan; Zhang, Lei; Zhong, Shengwen

doi:10.1080/14686996.2020.1824255

Cited by 46 publications

(19 citation statements)

References 118 publications

(155 reference statements)

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“…For this alloy, it is rather difficult for dislocations to pass through the interfaces at phase boundaries. Moreover, boundary sliding at the phase boundaries is also very difficult in the as-cast Bi-Sn alloy as the Bi phase and the Sn phase lamellar structures are closely interlocked within each other [31][32][33][34]. It is reasonable to expect, therefore, that the ductility of the as-cast Bi-Sn alloy will be poor due to its lamellar structure, and this is confirmed in these experiments where the as-cast alloy had an elongation of only around 130% under a strain rate of 1.0 × 10 −4 s −1 .…”

Section: Discussionmentioning

confidence: 99%

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Wang

et al. 2021

Crystals

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Tube high-pressure shearing (t-HPS) processing was performed on a eutectic Bi–Sn (57/43) alloy for 0.25, 1, 5 and 20 turns. The selected samples were stored at room temperature for up to 56 days to examine the strain weakening and self-annealing behavior of the alloy. The results showed that t-HPS processing gradually refined the microstructure and led to decreasing of microhardness, but microhardness increased slowly during the subsequent storage at room temperature. Shear localization of the eutectic structure during t-HPS processing was observed as large amounts of narrow dense lamellar zones were visible in the deformed microstructures. The Bi–Sn (57/43) alloy processed by t-HPS exhibited significantly enhanced superplastic properties with elongations up to >1800% in a sample after t-HPS processing for 20 turns. This high elongation is attributed to the breaking of the lamellar structure and the very small grain size.

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Section: Discussionmentioning

confidence: 99%

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Wang

et al. 2021

Crystals

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“…52In-48Sn eutectic has a melting point of 118 °C. However, its cost is appreciably higher, due to the high cost of In [ 49 , 50 ].…”

Section: Methodsmentioning

confidence: 99%

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Silvestre

Llopis

Rodrigo

et al. 2022

Sensors

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The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate. Several patterns of different widths and gaps between tracks were tested in order to find the best design parameters for some footprint configurations. With respect to the incorporation of devices on textile substrates, the paper analyzes the soldering of surface mount devices on fabric substrates. Due to the substrate’s nature, low soldering temperatures must be used to avoid deformations or damage to the substrate caused by the higher temperatures used in conventional soldering. Several solder pastes used for low-temperature soldering are analyzed in terms of joint resistance and shear force application. The results obtained are satisfactory, demonstrating the viability of using flexible hybrid electronics with fabrics. As a practical result, a simple single-layer circuit was implemented to check the results of the research.

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“…26. The Young equation is as follows [87], Fig. 23 FE-SEM images of the fracture morphology of Sn-CNT of a Sn-5Sb-0.01CNT and b Sn-5Sb-0.05CNT in the solder matrix [83] Fig.…”

Section: Sn-agmentioning

confidence: 99%

“…Fig. 26 The surface tension diagram under equilibrium [87] Tikale et al [63] added 0.01-0.5 wt.% Al 2 O 3 nanoparticles to Sn-3.6Ag solder to improve the wettability of the solder. By adding 0.5 wt.% Al 2 O 3 particles into Sn-3.6Ag solder, the spreading area of solder increased from 28 to 36 mm 2 .…”

Section: Sn-agmentioning

confidence: 99%

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Wang

Zhang

2021

J Mater Sci: Mater Electron

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Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and flip-chip connections, etc., along with the application of electronic products more and more widely. These phenomena promote the further development of hightemperature solders. Because of the high melting temperatures of Sn-Ag and Sn-Sb, they are suitable for high-temperature fields such as automotive electronics and avionics. In this review, the influences of trace elements and nanoparticles on microstructure, intermetallic components (IMC) growth, mechanical properties, wettability, melting behavior, and creep behavior of Sn-Ag and Sn-Sb solders have been summarized systematically. It was found that the addition of trace elements or nanoparticles into solders to be beneficial in improving the performance of Sn-Ag and Sn-Sb solders. Besides, the melting behavior of the solder at high temperatures can be further improved if Sn-Ag and Sn-Sb are used better as high-temperature solders.

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Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Cited by 46 publications

References 118 publications

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Microstructural Evolution and Tensile Testing of a Bi–Sn (57/43) Alloy Processed by Tube High-Pressure Shearing

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

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