Review Nano and macro-structured component fabrication by electron beam-physical vapor deposition (EB-PVD)

Singh, Jogender; Wolfe, Douglas E.

doi:10.1007/s10853-005-5682-5

Cited by 173 publications

(95 citation statements)

References 6 publications

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“…8, 9 The EBPVD technique is based on the use of high-energy electron beams to assist in evaporation of metals, those vapors are then being expanded into vacuum and deposited on substrates.…”

Section: Introductionmentioning

confidence: 99%

Direct simulation Monte Carlo modeling of e-beam metal deposition

Venkattraman

Alexeenko

2010

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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Three-dimensional direct simulation Monte Carlo ͑DSMC͒ method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.

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Section: Introductionmentioning

confidence: 99%

Direct simulation Monte Carlo modeling of e-beam metal deposition

Venkattraman

Alexeenko

2010

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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“…Electron beams as PVD modification were used for deposition of alumina or composite cermets functional layers of carbides/nitrides (Singh & Wolfe, 2005). Only a few works mention e-beam as a promising approach to deposit thin and dense YSZ or GDC electrolyte layer on electrode (mainly NiO/YSZ anode ) (Laukaitis et al, 2007;Lemkey et al, 2005).…”

Section: Wwwintechopencommentioning

confidence: 99%

Advanced Sintering Techniques in Design of Planar IT SOFC and Supported Oxygen Separation Membranes

Садыков¹,

Usoltsev²,

Fedorova³

et al. 2012

Sintering of Ceramics - New Emerging Techniques

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“…For instance, Cu with 2 or 3 times, higher strength (achieved by alloying) usually has a loss of conductivity about 50 to 60 percent in comparison with pure copper. There are three different types coating processes: (1) vapor phase, which includes physical vapor deposition (PVD) and chemical vapor deposition (CVD); (2) liquid phase, which includes painting, dipping, and electroplating; and (3) solid phase, which includes plasma spray processes and laser cladding [3]. Depending on source of energy used for the deposition of coatings each process can again sub-classified.…”

Section: Introductionmentioning

confidence: 99%

Study of Structural and Morphological Properties of Vacuum Coated Copper (Cu) Metal Thin Film

Alam¹,

Mia²,

Rakhshandeh³

et al. 2015

MSA

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This study presented a technique to deposit high strength and highly conductive copper thin films on glass substrates at room temperature. In this work, Cu thin films with thicknesses ~500 nm have been deposited on glass substrate by thermal evaporation technique at room temperature. After deposition, these films have been annealed at 200˚C for 10 -40 minutes. The thickness and annealing effect on the structural and morphological properties were studied by X-ray diffraction (XRD) and scanning electron microscopy (SEM) respectively. The results showed that by increasing thickness the copper films crystallinity in (111) direction had been increased. Also by varying the annealing time the significant changes were observed in the films crystallinity and surface morphology.

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Review Nano and macro-structured component fabrication by electron beam-physical vapor deposition (EB-PVD)

Cited by 173 publications

References 6 publications

Direct simulation Monte Carlo modeling of e-beam metal deposition

Direct simulation Monte Carlo modeling of e-beam metal deposition

Advanced Sintering Techniques in Design of Planar IT SOFC and Supported Oxygen Separation Membranes

Study of Structural and Morphological Properties of Vacuum Coated Copper (Cu) Metal Thin Film

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