1988
DOI: 10.1002/crat.2170230109
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Revealing of lattice defects on (111) faces of gallium phosphide and indium phosphide by chemical etching

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Cited by 5 publications
(2 citation statements)
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“…Wet chemical defect etching is a fast method for routine quality control of substrate material. Mostly the AB-etch (ABRAHAMS, BUIOCCHI) and the HusER-etch (HUBER, LINH) were applied to InP-wafers (WAGNER, GOTTSCHALCH 1988). The revealed etch pits are correlated by shape and magnitude to various defect types.…”
Section: Introductionmentioning
confidence: 99%
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“…Wet chemical defect etching is a fast method for routine quality control of substrate material. Mostly the AB-etch (ABRAHAMS, BUIOCCHI) and the HusER-etch (HUBER, LINH) were applied to InP-wafers (WAGNER, GOTTSCHALCH 1988). The revealed etch pits are correlated by shape and magnitude to various defect types.…”
Section: Introductionmentioning
confidence: 99%
“…The revealed etch pits are correlated by shape and magnitude to various defect types. I n the literature (WAGNER, GOTTSCHALCH 1986, 1988 the larger pyramidal etch pits, produced by the Husm-etch, the so called D-pits, were correlated to grown-in dislocations. The smaller and flatter coneor bowl-shaped etch pits (S-pits) were attributed to microdefects, i.e.…”
Section: Introductionmentioning
confidence: 99%