Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study

Girardi, M. A.; Barner, Gregg; Lopez, Cristie; Duncan, Brent; Zawicki, L. R.

doi:10.4071/1551-4897-6.2.114

Cited by 9 publications

(11 citation statements)

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“…Recall that we have reduced the 1–2% shrinkage tolerance commonly specified by laboratories to about a quarter by taking into account Ref. 10. However, the fabricated circuit has entirely exhausted the envisaged range.…”

Section: Simulation and Experimental Resultsmentioning

confidence: 99%

“…An imprecise substrate length cannot be corrected by moving the circuit away or toward the transition, at least not equally at all ports. Recently, beyond the known average shrinkage, empirical studies have tried to better anticipate the size reduction [10]. It is therein considered as a function of the metalized surface and lamination pressure.…”

Section: Introductionmentioning

confidence: 99%

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Two layer LTCC substrate integrated to rectangular waveguide transition and its application for millimeter‐wave LTCC characterization

Peters

Denidni

Tatu

2012

Micro & Optical Tech Letters

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In this letter, a new practical approach for designing a millimeter‐wave transition at 76.5 GHz from substrate integrated waveguide (SIW) line on two low temperature cofired ceramics (LTCC) layers to a rectangular waveguide is proposed. To the best of our knowledge, this is the first feasible planar solution to couple a top‐layer SIW exclusively. A very small probe is cut in both layers and inserted into a milled clearance in the metallic waveguide. Shrinkage tolerance is addressed in particular in our design procedure. In addition, multiple back‐to‐back transitions are milled into one fixture and applied to obtain the actual LTCC loss tangent and permittivity. The latter undergoes a strong dispersion. Fabricated circuits are optically analyzed and exhibit a higher shrinkage than expected. Simulation and measurement results show good performances in terms of reflection and transmission. With these features, the proposed solution is able to handle electrically large substrates of around 12λg. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:2675–2679, 2012; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.27167

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Section: Simulation and Experimental Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Two layer LTCC substrate integrated to rectangular waveguide transition and its application for millimeter‐wave LTCC characterization

Peters

Denidni

Tatu

2012

Micro & Optical Tech Letters

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“…At 100˚C volume and physical property of LTCC tape remain unchanged while at 100˚C mechanical strength of single layer LTCC tape has increased.If a single layer LTCC green tape is placed in an oven for 50-60 minutes, and let allow the tape to settle for 24 hours, by this process the tape becomes rigid during the single-layer processing steps and this rigidity restricts tape movement (since stretching may cause misalignments and compromise shrinkage measurements at the surface) [6]. At 350˚C volume of LTCC tape remain almost unchanged, and mechanical strength of LTCC tape has become low and it is fragile,the surface color of LTCC tape becomes light blue.…”

Section: A Shrinkage Optimizationmentioning

confidence: 99%

“…Surface roughness plays an important role in printing of pattern on LTCC tape. Shrinkage in LTCC tape affects the high performance of LTCC technology [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Optimization of Shrinkage and Surface-Roughness of LTCC Tape

.¹

2013

IJRET

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The Low Temperature Co-fired Ceramics (LTCC) process is very popular in the electronics packaging industry and is broadly accepted for its low cost and rapid throughput. A multilayer LTCC 3-D structure generally shrinks during low temperature co-firing process. Shrinkage occurs in all three dimensions X, Y and Z. Shrinkage has added a challenge to get high performance with low temperature co-fired ceramics designs and limited the yields of LTCC modules, components, subsystems and designs. Roughness is the measure of texture of surface of LTCC tape and a quantitative analysis of vertical deviation of real surface from its ideal form. This paper describes variations in X, Y and Z directions of LTCC tape during firing at different temperatures and also describes about the surface roughness of LTCC tape. Data has been concentrated on the experimental results and observations.

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“…In [6] metal loading, lamination pressure and layer count were taken into consideration, while lamination time and temperature were fixed values. Here, the Dupont 951P2 tape was used and it was found that the metal loading and lamination pressure were significant factors.…”

Section: Introductionmentioning

confidence: 99%

Control of Low Temperature Co-fired Ceramic Shrinkage for Unconstrained Sintering

Kärnfelt

Sinou

2021

2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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The shrinkage of Low Temperature Co-fired Ceramics (LTCC) during firing is one of the most difficult features to control in LTCC fabrication, as many factors may impact on the result. The shrinkage given by the tape manufacturer is not perfectly transposable to a production environment where preparation, use and equipment is not in exact accordance. Thus, predictable shrinkage models are of main importance in order to fabricate LTCC devices according to specifications. The objective of this work is to develop such models for the Ferro L8 tape using the powerful Design of Experiments (DOE) technique. Four factors are varied; the stack thickness, the device surface, the applied pressure and the temperature during lamination. Other factors such as operator, lamination time or firing profile are kept to a fixed value during these experiments. The result variables are lamination quality and x, y and z-direction shrinkage. Lamination quality is found to be mainly impacted by the interaction between the stack thickness and the surface area of the stack, while for the z-direction shrinkage this interaction together with lamination temperature are significant factors and finally for the lateral shrinkage the main effects stack thickness, surface area and temperature are significant. Numerical models for shrinkage in zand lateral directions are established. This work enforces the understanding of the shrinkage of LTCC and permits for the Ferro L8 users correctly compensate the layout for shrinkage.

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Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study

Abstract: The Low Temperature Cofired Ceramic (LTCC)

Cited by 9 publications

References 0 publications

Two layer LTCC substrate integrated to rectangular waveguide transition and its application for millimeter‐wave LTCC characterization

Two layer LTCC substrate integrated to rectangular waveguide transition and its application for millimeter‐wave LTCC characterization

Optimization of Shrinkage and Surface-Roughness of LTCC Tape

Control of Low Temperature Co-fired Ceramic Shrinkage for Unconstrained Sintering

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