Optimization of Shrinkage and Surface-Roughness of LTCC Tape

Abstract

The Low Temperature Co-fired Ceramics (LTCC) process is very popular in the electronics packaging industry and is broadly accepted for its low cost and rapid throughput. A multilayer LTCC 3-D structure generally shrinks during low temperature co-firing process. Shrinkage occurs in all three dimensions X, Y and Z. Shrinkage has added a challenge to get high performance with low temperature co-fired ceramics designs and limited the yields of LTCC modules, components, subsystems and designs. Roughness is the measure of texture of surface of LTCC tape and a quantitative analysis of vertical deviation of real surface from its ideal form. This paper describes variations in X, Y and Z directions of LTCC tape during firing at different temperatures and also describes about the surface roughness of LTCC tape. Data has been concentrated on the experimental results and observations.