LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Induja, I.J.; Abhilash, Pulanchiyodan; Arun, S.; Surendran, Kuzhichalil Peethambharan; Sebastian, Mailadil Thomas

doi:10.1016/j.ceramint.2015.07.152

Cited by 72 publications

(36 citation statements)

References 37 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…At lower radio frequencies, all the four polarization mechanisms (electronic, dipolar, ionic and interfacial) will come into effect with contribution from the interfacial polarization at the highest, resulting in high dielectric constant. As the frequency increases, the influence of dipolar polarization will take over interfacial polarization, which can be observed as a reduction in the dielectric constant4647. Since sintered ceramic bodies are likely to contain a finite amount of porosity, which can detrimentally affect the apparent dielectric properties, Penn et al .…”

Section: Resultsmentioning

confidence: 99%

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Roshni

Sebastian

Surendran

2017

Sci Rep

View full text Add to dashboard Cite

Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK−1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK−1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm−1K−1 (thermal conductivity of alumina is about 24.5 Wm−1K−1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.

show abstract

Section: Resultsmentioning

confidence: 99%

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Roshni

Sebastian

Surendran

2017

Sci Rep

View full text Add to dashboard Cite

show abstract

“…The traditional method to lower the sintering temperature of the Al 2 O 3 is by glass addition. Several authors reported the effective role of glass in reducing the sintering temperature of Al 2 O 3 …”

Section: Introductionmentioning

confidence: 99%

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Induja

Sebastian

2017

J Am Ceram Soc

View full text Add to dashboard Cite

Ultralow‐temperature sinterable alumina‐45SnF2:25SnO:30P2O5 glass (Al2O3‐SSP glass) composite has been developed for microelectronic applications. The 45SnF2:25SnO:30P2O5 glass prepared by melt quenching from 450°C has a low Tg of about 93°C. The SSP glass has εr and tanδ of 20 and 0.007, respectively, at 1 MHz. In the microwave frequency range, it has εr=16 and Qu × f=990 GHz with τf=−290 ppm/°C at 6.2 GHz with coefficient of thermal expansion (CTE) value of 17.8 ppm/°C. A 30 wt.% Al2O3‐70 wt.% SSP composite was prepared by sintering at different temperatures from 150°C to 400°C. The crystalline phases and dielectric properties vary with sintering temperature. The alumina‐SSP composite sintered at 200°C has εr=5.41 with a tanδ of 0.01 (1 MHz) and at microwave frequencies it has εr=5.20 at 11 GHz with Qu × f=5500 GHz with temperature coefficient of resonant frequency (τf)=−18 ppm/°C. The CTE and room‐temperature thermal conductivity of the composite sintered at 200°C are 8.7 ppm/°C and 0.47 W/m/K, respectively. The new composite has a low sintering temperature and is a possible candidate for ultralow‐temperature cofired ceramics applications.

show abstract

“…Nevertheless, because the sintering temperature of alumina is relatively high (approximately 1500°C), co-fired conductor materials such as W or Mo have been used, as these have melting points higher than the sintering temperature of alumina as well as high electrical resistance. However, because LTCC materials generally contain large amounts of glass (approximately 50 % of the total mass), which contributes to their low sintering temperatures, the majority of these materials have shortcomings, namely, low thermal conductivity (~2-7 W/mK) 8,9 and low mechanical strength. [6][7][8][9] Because LTCC materials enable the fabrication of, for example, built-in capacitors, inductors, and low-loss transmission lines, they are widely used in the production of high-frequency modules.…”

Section: Introductionmentioning

confidence: 99%

Examination of non‐shrinkage firing using low‐temperature co‐fired alumina containing a small quantity of Cu–Ti–Nb–Ag–O additive

Shigeno

Tezuka

2019

Int J Applied Ceramic Tech

View full text Add to dashboard Cite

In this study, we examined non‐shrinkage firing in the planar direction using low‐temperature co‐fired alumina (LTCA) containing a small quantity of Cu–Ti–Nb–Ag–O additive. A good restraint effect was obtained using AL‐43‐L alumina as a constraint layer whose particle diameter was several times larger (1 to 2 μm) than that of alumina in the LTCA material TM‐5D (0.2 μm). The x‐y shrinkage ratio of the non‐shrinkage fired sample using AL‐43‐L as the constraint layer was within 2 %. However, the density of the non‐shrinkage fired sample was much lower than that of the normal shrinkage fired sample. By producing a powder using a freeze‐dry method, we obtained a well‐sintered alumina with a relative density of approximately 95 % at 950°C, which is lower than the melting point of silver. That is, we achieved both suppression of the shrinkage rate in the x‐y direction and ensured sinterability below the melting point of silver. The thermal conductivity of the sample was 16.2 W/mK, which is extremely high for low‐temperature co‐fired ceramics materials.

show abstract

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Cited by 72 publications

References 37 publications

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications

Examination of non‐shrinkage firing using low‐temperature co‐fired alumina containing a small quantity of Cu–Ti–Nb–Ag–O additive

Contact Info

Product

Resources

About

LTCC tapes based on Al2O3–BBSZ glass with improved thermal conductivity

Cited by 72 publications

References 37 publications

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

Microwave dielectric properties of SnO‐SnF2‐P2O5 glass and its composite with alumina for ULTCC applications

Examination of non‐shrinkage firing using low‐temperature co‐fired alumina containing a small quantity of Cu–Ti–Nb–Ag–O additive

Contact Info

Product

Resources

About

Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications