Response of an electrostatically actuated microbeam to drop-table test

Ouakad, Hassen M.; Younis, Mohammad I.; Alsaleem, Fadi; Levo, T.; Pitarresi, James M.

doi:10.1109/esime.2010.5464603

Cited by 3 publications

(6 citation statements)

References 10 publications

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“…Since this microbeam is too short, it requires very high level of gs to be brought down to touch the substrate (more than 200,000g) [34]. Such a high level of g is hard to be generated experimentally.…”

Section: Cantilever Microbeamsmentioning

confidence: 99%

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Mechanical Shock in MEMS

Younis

2011

Microsystems

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This chapter addresses a reliability issue of MEMS that is crucial for their commercialization, which is their survivability under mechanical shocks. Unlike conventional electronics of passive elements, MEMS contain flexible components that are deliberately designed to undergo some kind of motion. Thus, a natural question comes of how these microstructures respond when they are subjected to dynamic shock loads? What about short circuit and stiction when they make contacts with the substrate or stationary electrodes due to shock loads? These are some of the issues that are treated in this chapter. In addition, the impact of electrostatic forces on the dynamic response is illustrated. The interaction of the motion of microstructures with the printed circuit boards where they are mounted on is also discussed. IntroductionWith the rapid growth and maturity of the MEMS technology, many device concepts are ready to make the transition from research labs to consumer products. One of the critical issues affecting the commercialization of MEMS devices is their reliability and survivability under mechanical shock and impact. Several MEMS components have already made it to the market and being increasingly integrated and embedded into handheld devices and consumer products, such as the interactive motion-sensitive video games and smart phones. In such environments, there is an obvious need to ensure the durability and reliability of MEMS to sustain the various dynamic loads while being used by consumers.MEMS generally can be exposed to shock during fabrication, deployment, shipping, and operation. Also, a crucial criterion for automotive and industrial applications is the survivability of portable devices containing MEMS when dropped on hard surfaces, which can induce significant shock loads. For some applications, MEMS are expected to survive sever dynamic loading, such as the harsh environments in military applications. In addition, aerospace applications rely on pyrotechnic devices, which generate dangerous shock waves of amplitude reaching hundreds of thousands of gs. MEMS sensors and devices in these applications are required to survive such severe environments.

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Section: Cantilever Microbeamsmentioning

confidence: 99%

“…In [28][29][30][31][32][33][34] the response of microstructures under the combined effects of mechanical shock and electrostatic forces has been investigated theoretically and experimentally. Computationally efficient approaches to study shock in MEMS were presented in [35].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Shock in MEMS

Younis

2011

Microsystems

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“…Several works have been published studying the reliability of MEMS devices under mechanical shock [5], [6], [7], [8], [9]. Several papers investigated the response of microstructure under the combined effect of electrostatic forces and mechanical shock [5], [7], [9].…”

Section: Introductionmentioning

confidence: 99%

“…Several papers investigated the response of microstructure under the combined effect of electrostatic forces and mechanical shock [5], [7], [9]. These explained the failure of MEMS devices subjected to shock load and showed that a mechanical shock load, even moderate in magnitude, can affect the stability of microstructure electrostatically actuated by reducing its dynamic pull-in, causing therefore an early failure.…”

Section: Introductionmentioning

confidence: 99%

“…Younis et al [5] used a one degree of freedom system, while in [7] Younis et al used a clamped-clamped beam model. Ouakad et al [9] presented an experimental investigation of the response of electrostatically actuated microbeams to mechanical shock. In [10], the response of a MEMS resonators when subjected to mechanical shock was investigated.…”

Section: Introductionmentioning

confidence: 99%

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Modeling and Design of an Electrically Actuated Resonant Switch

Jrad

Younis

Najar

2012

MATEC Web of Conferences

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Abstract. We present modeling and simulation of a new device concept of an electrically actuated resonant switch (EARS), which can be tuned to be triggered at low levels of acceleration, as low as those of earthquakes. The device is realized by mounting an electrostatically actuated cantilever microbeam with a mass at the tip on top of a compliant board or a printed circuit board PCB, which is modeled as a hinged-hinged beam. A distributed-parameter model of the device is derived for the microbeam and the PCB using Hamilton's principle based on the Euler-Bernoulli beam model. The equations are then discretized using the Galerkin procedure. A nonlinear numerical dynamic analysis is performed in order to characterize the behavior and performance of the device when subjected to acceleration pulses. We conduct a parametric study showing several curves of dynamic pull-in threshold for various values of electric voltage loads and frequency of excitations. We show that the device can be triggered at a wide range of acceleration ranging from 0.4g-200g for various values of the DC and AC voltages.

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Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

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Response of an electrostatically actuated microbeam to drop-table test

Cited by 3 publications

References 10 publications

Mechanical Shock in MEMS

Mechanical Shock in MEMS

Modeling and Design of an Electrically Actuated Resonant Switch

Reliability of MEMS in Shock Environments: 2000–2020

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