Resin flow characteristics of underfill process on flip chip encapsulation

Shen, Yung Kang; Ju, Cai; Shie, Y.; Chien, Hung

doi:10.1016/j.icheatmasstransfer.2004.08.005

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…where E1 and E2 are the activation energies, A1 and A2 are the Arrhenius pre-exponential factors, m1 and m2 are the reaction orders and T is the absolute temperature. These viscosity and curing models have been used by many scholars (Yang et al, 1997, Chang et al, 2004, Shen et al, 2004. Table 1 lists the material properties of EME 6300HN.…”

Section: Governing Equationsmentioning

confidence: 99%

Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

Ishak

Abdullah

Aziz

et al. 2017

JAFM

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The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages.

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Section: Governing Equationsmentioning

confidence: 99%

Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

Ishak

Abdullah

Aziz

et al. 2017

JAFM

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show abstract

“…Kamal curing model was applied for modeling the EMC curing rate. Many scholars [9][10][11][12][16][17][18] have used these viscosity and curing models in predicting the encapsulation process of electronic packaging. The equations of Kamal curing model can be expressed as…”

Section: Rheokinetic Modelmentioning

confidence: 99%

Analysis of encapsulation process in 3D stacked chips with different microbump array

Ong¹,

Abdullah²,

Khor³

et al. 2012

International Communications in Heat and Mass Transfer

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“…The volume force was then included in the momentum equation as an external force term. However, in the most studies [3][4][5][6][8][9][10]15,16], the wall adhesive effect (including the surface of the substrate, the die and the bumps) was neglected. Only a few studies involved the effect in the capillary action by simply-modifying the normal vectors of the nodes in contact with the wall [11,13].…”

Section: Introductionmentioning

confidence: 99%