Analysis of encapsulation process in 3D stacked chips with different microbump array

Ong, Ernest E.S.; Abdullah, M. Z.; Khor, C. Y.; Loh, Wei Keat; Ooi, C. K.; Chan, R.

doi:10.1016/j.icheatmasstransfer.2012.10.007

Cited by 31 publications

(4 citation statements)

References 15 publications

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“…The density of the underfill fluid that is used in this simulation is 1042 kg/m 3 with dynamic viscosity, μ of 2.2Pa∙s as used previously in the underfill encapsulation process [ 33 , 34 ]. The bond number used is 1108 and is calculated using the following formulation: …”

Section: Methodsmentioning

confidence: 99%

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

et al. 2016

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This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow front, pressure and velocity for different time intervals are determined and analyzed for potential problems relating to solder bump damage. The simulation results from Lattice Boltzmann Method (LBM) code will be validated with experimental findings as well as the conventional Finite Volume Method (FVM) code to ensure highly accurate simulation setup. Based on the findings, good agreement can be seen between LBM and FVM simulations as well as the experimental observations. It was shown that only LBM is capable of capturing the micro-voids formation. This study also shows an increasing trend in fluid filling time for BGA with perimeter, middle empty and full orientations. The perimeter orientation has a higher pressure fluid at the middle region of BGA surface compared to middle empty and full orientation. This research would shed new light for a highly accurate simulation of encapsulation process using LBM and help to further increase the reliability of the package produced.

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Section: Methodsmentioning

confidence: 99%

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

et al. 2016

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“…This situation added thermal energy in the upper layer results in a distinct temperature difference between the upper and lower layers referred to as a thermal delta. Through experimentation and numerical simulations, this research sought to demonstrate the efficacy of thermal delta in resolving the low mentioned above during the encapsulation of a multi-stack BGA [6]. The ball grid array has been the subject of significant research (BGA).…”

Section: Introductionmentioning

confidence: 99%

Package-on-Package (Pop) Underfill Process Using a Material Dam Method

Ali

Khor²,

Azmi³

et al. 2022

AEJ

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Recent developments in the electronics industry have introduced a multi-stack ball grid array (BGA) to meet the growing consumer demand for both high-performance and smaller-sized chip packages. This study focused on the preliminary study of the Package-on-Package (PoP) underfill process using a material dam method. High viscosity type of underfill material is considered for the underfill process. In the current experimental work, L path-dispensing method was chosen due to its advantages, as reported in the previous work. The material dam method was used to prevent underfill from moving backwards and flowing out from the dispensing region. The material dam was built surrounding the PoP package. The effectiveness of the underfill process was analyzed based on the cycle time and lateral lapping, which are significant factors in material selection. The experimental results revealed that slow underfill flow may cause the quickly harden of material while the dispensing process is still running. This situation restricts the underfill flow and creates voids in the PoP package. The material dam method successfully enhanced the underfilling process for layers 3 and 4 stacked-package. This study is expected to provide the preliminary underfill process of stacking the PoP package and is useful as a reference for the engineer in the microelectronics industry.

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“…Later, a more throughout research on the encapsulation process of multi-stack chip is done by Ong et al (2014) where they conducted a series of experiments and simulations to study the fluid flow and structural deformation while particularly emphasizing on the stress distributions. Ong et al (2012) studied the encapsulation process of multi-stack chips by investigating the influence of different arrangement of solder ball arrays on the encapsulant flow in multi-stack chips. They eventually found the BGA arrangements had minimum influence on the pressure distributions.…”

Section: Introductionmentioning

confidence: 99%

Effect of different temperature distribution on multi-stack BGA package

Tung

Abas

et al. 2021

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Purpose This paper aims to determine the optimum set of temperatures through correlation study to attain the most effective capillary flow of underfill in a multi-stack ball grid array (BGA) chip device. Design/methodology/approach Finite volume method is implemented in the simulation. A three-layer multi-stack BGA is modeled to simulate the underfill flow. The simulated models were well validated with the previous experimental work on underfill process. Findings The completion filling time shows high regression R-squared value of up to 0.9918, which indicates a substantial acceleration on the underfill process because of incorporation of thermal delta. An introduction of 11 °C thermal delta to the multi-stacks BGA managed to reduce the filling time by up to 16.4%. Practical implications Temperature-induced capillary flow is a relatively new type of driven underfill designed specifically for package on package BGA components. Its simple implementation can further improve the productivity of existing underfill process in the industry that is desirable in reducing the process lead time. Originality/value The effect of temperature-induced capillary flow in underfill encapsulation on multi-stacks BGA by means of statistical correlation study is a relatively new topic, which has never been reported in any other research according to the authors’ knowledge.

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Analysis of encapsulation process in 3D stacked chips with different microbump array

Cited by 31 publications

References 15 publications

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

Package-on-Package (Pop) Underfill Process Using a Material Dam Method

Effect of different temperature distribution on multi-stack BGA package

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