2015
DOI: 10.1109/ted.2015.2455558
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Replacement and Rearrangement of an Oxide Lattice by Germanium Doping in Solution-Processed Indium–Zinc-Oxide Thin-Film Transistors

Abstract: Germanium (Ge) doping effects on solutionprocessed indium-zinc-oxide (IZO) thin-film transistors (TFTs) were investigated. Ge doping increased the carrier concentration of Ge-doped IZO (Ge:IZO) thin films from 3.32 × 10 14 to 3.13 × 10 15 cm 3 by Ge substitution for zinc (Zn). Ge easily substituted for Zn in the IZO active layer, due to its comparably small atomic radius. By this substitution, Ge doping provided additional valence electrons to the active layer, resulting in a value for the field-effect mobilit… Show more

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Cited by 5 publications
(3 citation statements)
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“…This peak indicates that organic materials start to decompose at this temperature. In our results, a remarkably low-temperature exothermic peak appeared compared with many DCS graphs of IZO solutions from previous studies. Thus, we concluded that the low-temperature solution process was feasible.…”
Section: Results and Discussionsupporting
confidence: 75%
“…This peak indicates that organic materials start to decompose at this temperature. In our results, a remarkably low-temperature exothermic peak appeared compared with many DCS graphs of IZO solutions from previous studies. Thus, we concluded that the low-temperature solution process was feasible.…”
Section: Results and Discussionsupporting
confidence: 75%
“…Many researches have been proposed to improve these inferior characteristics of the solution-processed AOS TFTs, such as those on composition modification, dopant addition, additive addition, plasma treatment, and UV irradiation [6][7][8][9][10]. These methods, however, could not address one inherent limitation of the solution-processed AOS films: their low film density.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome these issues, many researchers have investigated with various methods to realize high performance and stable TFTs. In order to improve the μ FET , methods such as material doping, plasma treatment, and use of high-k gate insulator have been conducted [4][5][6]. For the high stability, methods such as oxidant treatment and use of multi-stacked structure have been conducted [7,8].…”
Section: Introductionmentioning
confidence: 99%